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参数资料
| 型号： | IR3523MTRPBF |
| 厂商： | International Rectifier |
| 文件页数： | 35/37页 |
| 文件大小： | 0K |
| 描述： | IC XPHASE3 CTLR VR11.1 40-MLPQ |
| 标准包装： | 3,000 |
| 系列： | XPhase3™ |
| 应用： | 处理器 |
| 电流 - 电源： | 10mA |
| 电源电压： | 4.75 V ~ 7.5 V |
| 工作温度： | 0°C ~ 100°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 40-MLPQ |
| 供应商设备封装： | 40-MLPQ（6x6） |
| 包装： | 带卷 (TR) |
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IR3523
SOLDER RESIST
? The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
? The minimum solder resist width is 0.13mm.
? At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
fillet so a solder resist width of ≥ 0.17mm remains.
? The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
? Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
aspect ratio of the solder resist strip separating the lead lands from the pad land.
? The single via in the land pad should be tented or plugged from bottom boardside with solder resist.
Page 35 of 37
June 20, 2008
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相关代理商/技术参数 |
参数描述 |
|---|---|
| IR3527 | 制造商:IRF 制造商全称:International Rectifier 功能描述:XPHASE3TM DUAL PHASE IC |
| IR3527MPBF | 制造商:IRF 制造商全称:International Rectifier 功能描述:XPHASE3TM DUAL PHASE IC |
| IR3527MTRPBF | 功能描述:开关变换器、稳压器与控制器 XPHASE3 Dual Phase 7V 1.3A PMIC RoHS:否 制造商:Texas Instruments 输出电压:1.2 V to 10 V 输出电流:300 mA 输出功率: 输入电压:3 V to 17 V 开关频率:1 MHz 工作温度范围: 安装风格:SMD/SMT 封装 / 箱体:WSON-8 封装:Reel |
| IR3529 | 制造商:IRF 制造商全称:International Rectifier 功能描述:XPHASE3TM PHASE IC |
| IR3529MPBF | 制造商:IRF 制造商全称:International Rectifier 功能描述:XPHASE3TM PHASE IC |
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