参数资料
型号: IRF5210L
厂商: International Rectifier
文件页数: 2/11页
文件大小: 0K
描述: MOSFET P-CH 100V 40A TO-262
标准包装: 50
系列: HEXFET®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 40A
开态Rds(最大)@ Id, Vgs @ 25° C: 60 毫欧 @ 24A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 180nC @ 10V
输入电容 (Ciss) @ Vds: 2700pF @ 25V
功率 - 最大: 3.8W
安装类型: 通孔
封装/外壳: TO-262-3,长引线,I²Pak,TO-262AA
供应商设备封装: TO-262
包装: 管件
其它名称: *IRF5210L
IRF5210S/L
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
-100
–––
––– V V GS = 0V, I D = -250μA
? V (BR)DSS / ? T J Breakdown Voltage Temp. Coefficient
–––
-0.11
–––
V/°C Reference to 25°C, I D = -1mA ?
R DS(on)
Static Drain-to-Source On-Resistance
–––
–––
0.06
?
V GS = -10V, I D = -24A ?
––– R G = 2.5 ?
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
-2.0
10
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
17
86
79
81
-4.0 V V DS = V GS , I D = -250μA
––– S V DS = -50V, I D = -21A ?
-25 V DS = -100V, V GS = 0V
μA
-250 V DS = -80V, V GS = 0V, T J = 150°C
100 V GS = 20V
nA
-100 V GS = -20V
180 I D = -21A
25 nC V DS = -80V
97 V GS = -10V, See Fig. 6 and 13 ??
––– V DD = -50V
––– I D = -21A
ns
––– R D = 2.4 ?, See Fig. 10 ?
L S
Internal Source Inductance
–––
7.5
–––
nH
Between lead,
and center of die contact
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
2700
790
450
––– V GS = 0V
––– pF V DS = -25V
––– ? = 1.0MHz, See Fig. 5 ?
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I S
I SM
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ?
––– –––
––– –––
-40
-140
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
G
D
S
V SD
Diode Forward Voltage
––– –––
-1.6 V T J = 25°C, I S = -24A, V GS = 0V ?
t rr
Q rr
t on
Notes:
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
––– 170 260 ns T J = 25°C, I F = -21A
––– 1.2 1.8 μC di/dt = -100A/μs ??
Intrinsic turn-on time is negligible (turn-on is dominated by L S +L D )
? Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
? Starting T J = 25°C, L = 3.1mH
R G = 25 ? , I AS = -21A. (See Figure 12)
? Pulse width ≤ 300μs; duty cycle ≤ 2%.
? Uses IRF5210 data and test conditions
? I SD ≤ -21A, di/dt ≤ -480A/μs, V DD ≤ V (BR)DSS ,
T J ≤ 175°C
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
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