参数资料
型号: IRF7809ATR
厂商: International Rectifier
文件页数: 1/4页
文件大小: 0K
描述: MOSFET N-CH 30V 14.5A 8-SOIC
标准包装: 4,000
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 14.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 8.5 毫欧 @ 15A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 75nC @ 5V
输入电容 (Ciss) @ Vds: 7300pF @ 16V
功率 - 最大: 2.5W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
PD - 93810
PD - 93811
IRF7809A/IRF7811A
PROVISIONAL DATASHEET
?
?
?
N-Channel Application-Specific MOSFETs
Ideal for CPU Core DC-DC Converters
Low Conduction Losses
HEXFET ? Chipset for DC-DC Converters
?
?
Low Switching Losses
Minimizes Parallel MOSFETs for high current
S
1
8
A
A
D
applications
Description
These new devices employ advanced HEXFET ? Power
MOSFET technology to achieve an unprecedented balance
of on-resistance and gate charge. The reduced conduction
and switching losses make them ideal for high efficiency
SO-8
S
S
G
2
3
4
T o p V ie w
7
6
5
D
D
D
DC-DC converters that power the latest generation of
microprocessors.
Both the IRF7809A and IRF7811A have been optimized
and are 100% tested for all parameters that are critical in
DEVICE RATINGS
synchronous buck converters including R DS(on) , gate charge
and Cdv/dt-induced turn-on immunity. The IRF7809A offers
particulary low R DS(on) and high Cdv/dt immunity for
synchronous FET applications. The IRF7811A offers an
extremely low combination of Q sw & R DS(on) for reduced
losses in control FET applications.
The package is designed for vapor phase, infra-red,
convection, or wave soldering techniques. Power
V DS
R DS (on)
Q G
Q sw
Q oss
IRF7809A
30V
8.5 m ?
73 nC
22.5 nC
30 nC
IRF7811A
28V
12 m ?
23 nC
7 nC
31 nC
dissipation of greater than 2W is possible in a typical PCB
mount application.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
IRF7809A
30
±12
IRF7811A
28
Units
V
Continuous Drain or Source
T A = 25°C
I D
14.5
11.4
Current (V GS ≥ 4.5V)
Pulsed Drain Current ?
Power Dissipation
T L = 90°C
T A = 25°C
I DM
P D
14.2
100
2.5
11.2
100
A
W
T L = 90°C
2.4
Junction & Storage Temperature Range
T J , T STG
–55 to 150
°C
Continuous Source Current (Body Diode)
Pulsed Source Current ?
I S
I SM
2.5
50
2.5
50
A
Thermal Resistance
Parameter
Max.
Units
Maximum Junction-to-Ambient ?
Maximum Junction-to-Lead
www.irf.com
R θ JA
R θ JL
50
25
°C/W
°C/W
1
01/19/00
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