参数资料
型号: IRF9410TRPBF
厂商: International Rectifier
文件页数: 2/7页
文件大小: 0K
描述: MOSFET N-CH 30V 7A 8-SOIC
产品目录绘图: IR Hexfet 8-SOIC
标准包装: 1
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
开态Rds(最大)@ Id, Vgs @ 25° C: 30 毫欧 @ 7A,10V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 27nC @ 10V
输入电容 (Ciss) @ Vds: 550pF @ 25V
功率 - 最大: 2.5W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 标准包装
其它名称: IRF9410PBFDKR
IRF9410PbF
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
30
???
??? V V GS = 0V, I D = 250μA
? V (BR)DSS / ? T J
Breakdown Voltage Temp. Coefficient
???
0.024
???
V/°C Reference to 25°C, I D = 1mA
2.0 V DS = 24V, V GS = 0V
25 V DS = 24V, V GS = 0V, T J = 55°C
nA
ns
R DS(on)
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
C iss
C oss
C rss
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
???
???
???
1.0
???
???
???
???
???
???
???
???
???
???
???
???
???
???
???
0.024
0.032
0.037
???
14
???
???
???
???
18
2.4
4.9
7.3
8.3
23
17
550
260
100
0.030 V GS = 10V, I D = 7.0A ?
0.040 ? V GS = 5.0V, I D = 4.0A ?
0.050 V GS = 4.5V, I D = 3.5A ?
??? V V DS = V GS , I D = 250μA
??? S V DS = 15V, I D = 7.0A
μA
100 V GS = 20V
-100 V GS = -20V
27 I D = 2.0A
3.6 nC V DS = 15V
7.4 V GS = 10V, See Fig. 10 ?
15 V DD = 25V
17 I D = 1.0A
46 R G = 6.0 ?, V GS = 10V
34 R D = 25 ? ?
??? V GS = 0V
??? pF V DS = 25V
??? ? = 1.0MHz, See Fig. 9
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I S
I SM
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ?
???
???
???
???
2.8
37
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
G
D
S
V SD
t rr
Q rr
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
??? 0.78
??? 40
??? 63
1.0
80
130
V
ns
nC
T J = 25°C, I S = 2.0A, V GS = 0V ?
T J = 25°C, I F = 2.0A
di/dt = 100A/μs ?
Notes:
? Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
? Starting T J = 25°C, L = 6.6mH
R G = 25 ? , I AS = 4.6A.
? Surface mounted on FR-4 board, t ≤ 10sec.
2
? I SD ≤ 4.6A, di/dt ≤ 120A/μs, V DD ≤ V (BR)DSS ,
T J ≤ 150°C
? Pulse width ≤ 300μs; duty cycle ≤ 2%.
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