参数资料
型号: IRF9630STRLPBF
厂商: Vishay Siliconix
文件页数: 1/9页
文件大小: 0K
描述: MOSFET P-CH 200V 6.5A D2PAK
标准包装: 1
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 200V
电流 - 连续漏极(Id) @ 25° C: 6.5A
开态Rds(最大)@ Id, Vgs @ 25° C: 800 毫欧 @ 3.9A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 29nC @ 10V
输入电容 (Ciss) @ Vds: 700pF @ 25V
功率 - 最大: 3W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D2PAK
包装: 标准包装
其它名称: IRF9630STRLPBFDKR
IRF9630S, SiHF9630S
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
FEATURES
? Halogen-free According to IEC 61249-2-21
V DS (V)
- 200
Definition
R DS(on) ( ? )
Q g (Max.) (nC)
V GS = - 10 V
29
0.80
? Surface Mount
? Available in Tape and Reel
? Dynamic dV/dt Rating
Q gs (nC)
Q gd (nC)
Configuration
D 2 PAK (TO-263)
5.4
15
Single
S
? Repetitive Avalanche Rated
? P-Channel
? Fast Switching
? Ease of Paralleling
? Compliant to RoHS Directive 2002/95/EC
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
G
ruggedized device design,
cost-effectiveness.
low on-resistance and
The D 2 PAK (TO263) is a surface mount power package
capable of accommodating die size up to HEX-4. It provides
G D
S
D
P-Channel MOSFET
the highest power capability and the lowest possible
on-resistance in any existing surface mount package. The
D 2 PAK (TO263) is suitable for high current applications
because of its low internal connection resistance and can
dissipate up to 2.0 W in a typical surface mount application.
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
D 2 PAK (TO263)
SiHF9630S-GE3
IRF9630SPbF
SiHF9630S-E3
D 2 PAK (TO263)
SiHF9630STRL-GE3 a
IRF9630STRLPbF a
SiHF9630STL-E3 a
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS (T C = 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
SYMBOL
V DS
V GS
LIMIT
- 200
± 20
UNIT
V
Continuous Drain Current
V GS at - 10 V
T C = 25 °C
T C = 100 °C
I D
- 6.5
- 4.0
A
Pulsed Drain Current a
I DM
- 26
Linear Derating Factor
Linear Derating Factor (PCB Mount) e
0.59
0.025
W/°C
Single Pulse Avalanche Energy b
Avalanche Current a
Repetiitive Avalanche Energy a
E AS
I AR
E AR
500
- 6.4
7.4
mJ
A
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount) e
Peak Diode Recovery dV/dt c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
T C = 25 °C
T A = 25 °C
for 10 s
P D
dV/dt
T J , T stg
74
3.0
- 5.0
- 55 to + 150
300 d
W
V/ns
°C
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V DD = - 50 V, starting T J = 25 °C, L = 17 mH, R g = 25 ? , I AS = - 6.5 A (see fig. 12).
c. I SD ? - 6.5 A, dI/dt ? 120 A/μs, V DD ? V DS , T J ? 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91085
S11-1051-Rev. C, 30-May-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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