参数资料
型号: IRFR024NTRR
厂商: International Rectifier
文件页数: 2/11页
文件大小: 0K
描述: MOSFET N-CH 55V 17A DPAK
标准包装: 3,000
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 17A
开态Rds(最大)@ Id, Vgs @ 25° C: 75 毫欧 @ 10A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 20nC @ 10V
输入电容 (Ciss) @ Vds: 370pF @ 25V
功率 - 最大: 45W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
IRFR/U024N
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Conditions
V (BR)DSS
? V (BR)DSS / ? T J
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
55
–––
–––
0.052
––– V V GS = 0V, I D = 250μA
––– V/°C Reference to 25°C, I D = 1mA
R DS(on)
Static Drain-to-Source On-Resistance
–––
–––
0.075
?
V GS = 10V, I D = 10A
?
––– R G = 24 ?
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
2.0
4.5
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
4.9
34
19
27
4.0 V V DS = V GS , I D = 250μA
––– S V DS = 25V, I D = 10A ?
25 V DS = 55V, V GS = 0V
μA
250 V DS = 44V, V GS = 0V, T J = 150°C
100 V GS = 20V
nA
-100 V GS = -20V
20 I D = 10A
5.3 nC V DS = 44V
7.6 V GS = 10V, See Fig. 6 and 13 ??
––– V DD = 28V
––– I D = 10A
ns
––– R D = 2.6 ? , See Fig. 10 ?
L D
L S
Internal Drain Inductance
Internal Source Inductance
–––
–––
4.5
7.5
–––
–––
nH
Between lead,
6mm (0.25in.)
from package
and center of die contact ?
G
D
S
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
370
140
65
––– V GS = 0V
––– pF V DS = 25V
––– ? = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I S
I SM
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ?
––– –––
––– –––
17 ?
68
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
G
D
S
V SD
Diode Forward Voltage
––– ––– 1.3 V T J = 25°C, I S = 10A, V GS = 0V
?
t rr
Q rr
t on
Notes:
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
––– 56 83 ns T J = 25°C, I F = 10A
––– 120 180 nC di/dt = 100A/μs ??
Intrinsic turn-on time is negligible (turn-on is dominated by L S +L D )
? Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
? V DD = 25V, starting T J = 25°C, L = 1.0mH
R G = 25 ? , I AS = 10A. (See Figure 12)
? I SD ≤ 10A, di/dt ≤ 280A/μs, V DD ≤ V (BR)DSS ,
T J ≤ 175°C
2
? Pulse width ≤ 300μs; duty cycle ≤ 2%.
? This is applied for I-PAK, L S of D-PAK is measured between
lead and center of die contact.
? Uses IRFZ24N data and test conditions.
www.irf.com
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