参数资料
型号: IRFR9310
厂商: International Rectifier
英文描述: Power MOSFET(Vdss=-400V, Rds(on)=7.0ohm, Id=-1.8A)
中文描述: 功率MOSFET(减振钢板基本\u003d-为400V,的Rds(on)\u003d 7.0ohm,身份证\u003d- 1.8A)
文件页数: 2/10页
文件大小: 116K
代理商: IRFR9310
IRFR/U9310
Parameter
Min. Typ. Max. Units
-400
–––
–––
-0.41 –––
–––
–––
-2.0
–––
0.91
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
11
–––
10
–––
25
–––
24
Conditions
V
GS
= 0V, I
D
= -250μA
Reference to 25°C, I
D
= -1mA
V
GS
= -10V, I
D
= -1.1A
V
DS
= V
GS
, I
D
= -250μA
V
DS
= -50V, I
D
= -1.1A
V
DS
= -400V, V
GS
= 0V
V
DS
= -320V, V
GS
= 0V, T
J
= 125°C
V
GS
= 20V
V
GS
= -20V
I
D
= -1.1A
V
DS
= -320V
V
GS
= -10V, See Fig. 6 and 13
V
DD
= -200V
I
D
= -1.1A
R
G
= 21
R
D
= 180
,
See Fig. 10
Between lead,
6mm (0.25in.)
from package
and center of die contact
V
GS
= 0V
V
DS
= -25V
= 1.0MHz, See Fig. 5
V
(BR)DSS
V
(BR)DSS
/
T
J
Breakdown Voltage Temp. Coefficient
R
DS(on)
Static Drain-to-Source On-Resistance
V
GS(th)
Gate Threshold Voltage
g
fs
Forward Transconductance
Drain-to-Source Breakdown Voltage
–––
V
V/°C
V
S
7.0
-4.0
–––
-100
-500
100
-100
13
3.2
5.0
–––
–––
–––
–––
μA
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
nA
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
nC
–––
–––
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
270
50
8.0
–––
–––
–––
pF
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance
–––
–––
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I
S
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
J
= 25°C, I
S
= -1.1A, V
GS
= 0V
T
J
= 25°C, I
F
= -1.1A
di/dt = 100A/μs
–––
–––
I
SM
–––
–––
V
SD
t
rr
Q
rr
t
on
–––
–––
–––
–––
170
640
-4.0
260
960
V
ns
nC
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
-1.8
-7.2
A
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
This is applied for I-PAK, L
S
of D-PAK is measured between
lead and center of die contact
Starting T
J
= 25°C, L = 57mH
R
G
= 25
, I
AS
= -1.8A. (See Figure 12)
I
SD
-1.1A, di/dt
450A/μs, V
DD
V
(BR)DSS
,
T
J
150°C
Pulse width
300μs; duty cycle
2%.
S
D
G
S
D
G
相关PDF资料
PDF描述
IRFU9310 Power MOSFET(Vdss=-400V, Rds(on)=7.0ohm, Id=-1.8A)
IRFS11N50A SMPS MOSFET
IRFS31N20DPBF HEXFET Power MOSFET ( VDSS = 200V , RDS(on)max = 0.082ヘ , ID = 31A )
IRFSL31N20DPBF HEXFET Power MOSFET ( VDSS = 200V , RDS(on)max = 0.082ヘ , ID = 31A )
IRFS3207PBF HEXFET㈢Power MOSFET
相关代理商/技术参数
参数描述
IRFR9310PBF 功能描述:MOSFET P-Chan 400V 1.8 Amp RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
IRFR9310TR 功能描述:MOSFET P-Chan 400V 1.8 Amp RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
IRFR9310TRA 制造商:KERSEMI 制造商全称:Kersemi Electronic Co., Ltd. 功能描述:Power MOSFET
IRFR9310TRL 功能描述:MOSFET P-Chan 400V 1.8 Amp RoHS:否 制造商:STMicroelectronics 晶体管极性:N-Channel 汲极/源极击穿电压:650 V 闸/源击穿电压:25 V 漏极连续电流:130 A 电阻汲极/源极 RDS(导通):0.014 Ohms 配置:Single 最大工作温度: 安装风格:Through Hole 封装 / 箱体:Max247 封装:Tube
IRFR9310TRLA 制造商:KERSEMI 制造商全称:Kersemi Electronic Co., Ltd. 功能描述:Power MOSFET