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参数资料
| 型号： | IRFSL4310ZPBF |
| 厂商： | International Rectifier |
| 英文描述： | HEXFET Power MOSFET |
| 中文描述： | HEXFET功率MOSFET |
| 文件页数： | 2/11页 |
| 文件大小： | 437K |
| 代理商： | IRFSL4310ZPBF |
2
www.irf.com
Calculated continuous current based on maximum allowable junction
temperature. Package limitation current is 75A
Repetitive rating; pulse width limited by max. junction
temperature.
Limited by T
Jmax
, starting T
J
= 25°C, L = 0.047mH
R
G
= 25
Ω
, I
AS
= 75A, V
GS
=10V. Part not recommended for use
above this value.
I
SD
≤
75A, di/dt
≤
600A/
μ
s, V
DD
≤
V
(BR)DSS
, T
J
≤
175°C.
Pulse width
≤
400
μ
s; duty cycle
≤
2%.
S
D
G
C
oss
eff. (TR) is a fixed capacitance that gives the same charging time
as C
oss
while V
DS
is rising from 0 to 80% V
DSS
.
C
oss
eff. (ER) is a fixed capacitance that gives the same energy as
C
oss
while V
DS
is rising from 0 to 80% V
DSS
.
When mounted on 1" square PCB (FR-4 or G-10 Material). For recom
mended footprint and soldering techniques refer to application note #AN-994.
θ
Static @ T
J
= 25°C (unless otherwise specified)
Symbol
V
(BR)DSS
Drain-to-Source Breakdown Voltage
Δ
V
(BR)DSS
/
Δ
T
J
Breakdown Voltage Temp. Coefficient
R
DS(on)
Static Drain-to-Source On-Resistance
V
GS(th)
Gate Threshold Voltage
I
DSS
Drain-to-Source Leakage Current
Parameter
Min. Typ. Max. Units
100
–––
–––
0.11
–––
4.8
2.0
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
0.7
–––
–––
6.0
4.0
20
250
100
-100
–––
V
V/°C
m
Ω
V
μ
A
I
GSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Internal Gate Resistance
nA
R
G
Dynamic @ T
J
= 25°C (unless otherwise specified)
Symbol
Parameter
gfs
Forward Transconductance
Q
g
Total Gate Charge
Q
gs
Gate-to-Source Charge
Q
gd
Gate-to-Drain ("Miller") Charge
Q
sync
Total Gate Charge Sync. (Q
g
- Q
gd
)
t
d(on)
Turn-On Delay Time
t
r
Rise Time
t
d(off)
Turn-Off Delay Time
t
f
Fall Time
C
iss
Input Capacitance
C
oss
Output Capacitance
C
rss
Reverse Transfer Capacitance
C
oss
eff. (ER) Effective Output Capacitance (Energy Related) –––
C
oss
eff. (TR)
Effective Output Capacitance (Time Related)
Ω
Min. Typ. Max. Units
150
–––
–––
120
–––
29
–––
35
–––
85
–––
20
–––
60
–––
55
–––
57
–––
6860
–––
490
–––
220
570
–––
920
–––
170
–––
S
nC
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
ns
pF
Diode Characteristics
Symbol
I
S
Parameter
Continuous Source Current
Min. Typ. Max. Units
–––
–––
127
A
(Body Diode)
Pulsed Source Current
I
SM
–––
–––
560
A
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
V
SD
t
rr
–––
–––
–––
–––
–––
–––
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
–––
40
49
58
89
2.5
1.3
V
ns
T
J
= 25°C
T
J
= 125°C
T
J
= 25°C
T
J
= 125°C
T
J
= 25°C
V
R
= 85V,
I
F
= 75A
di/dt = 100A/
μ
s
Q
rr
Reverse Recovery Charge
nC
I
RRM
t
on
Reverse Recovery Current
Forward Turn-On Time
–––
A
I
D
= 75A
R
G
= 2.7
Ω
V
GS
= 10V
V
GS
= 0V
V
DS
= 50V
= 1.0MHz, See Fig. 5
V
GS
= 0V, V
DS
= 0V to 80V , See Fig. 11
V
GS
= 0V, V
DS
= 0V to 80V
V
GS
= 10V
I
D
= 75A, V
DS
=0V, V
GS
= 10V
V
DD
= 65V
T
J
= 25°C, I
S
= 75A, V
GS
= 0V
integral reverse
p-n junction diode.
Conditions
V
GS
= 0V, I
D
= 250
μ
A
Reference to 25°C, I
D
= 5mA
V
GS
= 10V, I
D
= 75A
V
DS
= V
GS
, I
D
= 150
μ
A
V
DS
= 100V, V
GS
= 0V
V
DS
= 80V, V
GS
= 0V, T
J
= 125°C
V
GS
= 20V
V
GS
= -20V
MOSFET symbol
showing the
V
DS
=50V
Conditions
Conditions
V
DS
= 50V, I
D
= 75A
I
D
= 75A
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