参数资料
型号: IRLL014NTR
厂商: International Rectifier
文件页数: 2/9页
文件大小: 0K
描述: MOSFET N-CH 55V 2A SOT223
标准包装: 2,500
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 2A
开态Rds(最大)@ Id, Vgs @ 25° C: 140 毫欧 @ 2A,10V
Id 时的 Vgs(th)(最大): 2V @ 250µA
闸电荷(Qg) @ Vgs: 14nC @ 10V
输入电容 (Ciss) @ Vds: 230pF @ 25V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: TO-261-4,TO-261AA
供应商设备封装: SOT-223
包装: 带卷 (TR)
IRLL014N
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
55
–––
––– V V GS = 0V, I D = 250μA
? V (BR)DSS / ? T J
Breakdown Voltage Temp. Coefficient
–––
0.015
–––
V/°C
Reference to 25°C, I D = 1mA
–––
–––
0.14 V GS = 10V, I D = 2.0A ?
R DS(on)
Static Drain-to-Source On-Resistance
–––
–––
0.20
?
V GS = 5.0V, I D = 1.2A ?
–––
–––
0.28 V GS = 4.0V, I D = 1.0A ?
––– R G = 6.0 ?
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
C iss
C oss
C rss
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
1.0
2.3
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
9.5
1.1
3.0
5.1
4.9
14
2.9
230
66
30
2.0 V V DS = V GS , I D = 250μA
––– S V DS = 25V, I D = 1.0A
25 V DS = 55V, V GS = 0V
μA
250 V DS = 44V, V GS = 0V, T J = 150°C
100 V GS = 16V
nA
-100 V GS = -16V
14 I D = 2.0A
1.7 nC V DS = 44V
4.4 V GS = 10V, See Fig. 6 and 9 ?
––– V DD = 28V
––– I D = 2.0A
ns
––– R D = 14 ?, See Fig. 10 ?
––– V GS = 0V
––– pF V DS = 25V
––– ? = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
I S
I SM
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ?
––– –––
––– –––
1.3
16
A
MOSFET symbol
showing the
integral reverse
p-n junction diode.
V SD
t rr
Q rr
t on
Notes:
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
––– ––– 1.0 V T J = 25°C, I S = 2.0A, V GS = 0V ?
––– 41 61 ns T J = 25°C, I F = 2.0A
––– 73 110 nC di/dt = 100A/μs ?
Intrinsic turn-on time is negligible (turn-on is dominated by L S +L D )
? Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
? V DD = 25V, starting T J = 25°C, L = 4.0mH
R G = 25 ? , I AS = 4.0A. (See Figure 12)
2
? I SD ≤ 2.0A, di/dt ≤ 170A/μs, V DD ≤ V (BR)DSS ,
T J ≤ 150°C
? Pulse width ≤ 300μs; duty cycle ≤ 2%.
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