参数资料
型号: IRLMS6702TR
厂商: International Rectifier
文件页数: 1/8页
文件大小: 0K
描述: MOSFET P-CH 20V 2.4A 6-TSOP
标准包装: 1
系列: HEXFET®
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 2.4A
开态Rds(最大)@ Id, Vgs @ 25° C: 200 毫欧 @ 1.6A,4.5V
Id 时的 Vgs(th)(最大): 700mV @ 250µA
闸电荷(Qg) @ Vgs: 8.8nC @ 4.5V
输入电容 (Ciss) @ Vds: 210pF @ 15V
功率 - 最大: 1.7W
安装类型: 表面贴装
封装/外壳: 6-LSOP(0.063",1.60mm 宽)
供应商设备封装: Micro6?(TSOP-6)
包装: 剪切带 (CT)
其它名称: *IRLMS6702TR
IRLMS6702
IRLMS6702CT
PD - 91414C
IRLMS6702
HEXFET ? Power MOSFET
l
l
l
l
Generation V Technology
Micro6 Package Style
Ultra Low R DS(on)
P-Channel MOSFET
D
D
1
2
6
5
A
D
D
V DSS = -20V
Description
G
3
4
S
R DS(on) = 0.20 ?
Fifth Generation HEXFET ? power MOSFETs from
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance
per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that
HEXFET ? power MOSFETs are well known for,
provides the designer with an extremely efficient and
reliable device for use in a wide variety of applications.
The Micro6 ? package with its customized leadframe
produces a HEXFET ? power MOSFET with R DS(on)
60% less than a similar size SOT-23. This package is
ideal for applications where printed circuit board space
is at a premium. It's unique thermal design and R DS(on)
reduction enables a current-handling increase of
nearly 300% compared to the SOT-23.
Absolute Maximum Ratings
Top View
Micro6 ?
Parameter
Max.
Units
I D @ T A = 25°C
Continuous Drain Current, V GS @ -4.5V
-2.4
I D @ T A = 70°C
I DM
P D @T A = 25°C
V GS
dv/dt
T J, T STG
Continuous Drain Current, V GS @ -4.5V
Pulsed Drain Current ?
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Peak Diode Recovery dv/dt ?
Junction and Storage Temperature Range
-1.9
-13
1.7
13
± 12
5.0
-55 to + 150
A
W
mW/°C
V
V/ns
°C
Thermal Resistance Ratings
R θ JA
Parameter
Maximum Junction-to-Ambient ?
Min.
???
Typ.
???
Max
75
Units
°C/W
www.irf.com
1
3/18/04
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