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参数资料
| 型号： | ISL6218EVAL2 |
| 厂商： | Intersil |
| 文件页数： | 19/19页 |
| 文件大小： | 0K |
| 描述： | EVALUATION BOARD 2 FOR ISL6218 |
| 标准包装： | 1 |
| 主要目的： | DC/DC，步降 |
| 输入电压： | 5.6 ~ 25V |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | ISL6218 |
ISL6218
Thin Shrink Small Outline Plastic Packages (TSSOP)
N
INDEX
AREA
E1
-B-
E
0.25(0.010) M
GAUGE
PLANE
B M
M38.173
38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-153-BD-1 ISSUE F)
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
1
2
3
A
-
0.047
-
1.20
-
-A-
0.05(0.002)
D
SEATING PLANE
A
0.25
0.010
L
A1
A2
b
c
0.002
0.031
0.0075
0.0035
0.006
0.051
0.0106
0.0079
0.05
0.80
0.17
0.09
0.15
1.05
0.27
0.20
-
-
9
-
e
b
0.10(0.004) M
-C-
C A M
B S
A1
α
0.10(0.004)
A2
c
D
E1
e
E
L
0.378 0.386
0.169 0.177
0.0197 BSC
0.246 0.256
0.0177
0.0295
9.60 9.80
4.30 4.50
0.500 BSC
6.25 6.50
0.45
0.75
3
4
-
-
6
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-BD-1, Issue F.
N
α
0 o
38
8 o
0 o
38
8 o
7
-
Rev. 0 1/03
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
19
FN9101.6
August 6, 2007
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| ISL6219 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Microprocessor CORE Voltage Regulator Precision Multi-Phase BUCK PWM Controller for Mobile Applications |
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| ISL6219ACA | 功能描述:IC REG CTRLR BUCK PWM VM 28-SSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:4,000 系列:- PWM 型:电压模式 输出数:1 频率 - 最大:1.5MHz 占空比:66.7% 电源电压:4.75 V ~ 5.25 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 85°C 封装/外壳:40-VFQFN 裸露焊盘 包装:带卷 (TR) |
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