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参数资料
| 型号： | ISL6326CRZ-T |
| 厂商： | Intersil |
| 文件页数： | 23/30页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM VM 40-QFN |
| 标准包装： | 4,000 |
| PWM 型： | 电压模式 |
| 输出数： | 1 |
| 频率 - 最大： | 275kHz |
| 占空比： | 25% |
| 电源电压： | 4.75 V ~ 5.25 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 40-VFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
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ISL6326
TCOMP voltage can also be used to compensate for the
difference between the recommended TM voltage curve in
Figure 13 and that of the actual design. According to the
VCC voltage, ISL6326 converts the TCOMP pin voltage to a
4-bit TCOMP digital signal as TCOMP factor N.
The TCOMP factor N is an integer between 0 and 15. The
integrated temperature compensation function is disabled for
N = 0. For N = 4, the NTC temperature is equal to the
temperature of the current sense component. For N < 4, the
NTC is hotter than the current sense component. The NTC is
cooler than the current sense component for N > 4. When
N > 4, the larger TCOMP factor N, the larger the difference
11. If the output voltage increases over 2mV as the
temperature increases, i.e. V2 - V1 > 2mV, reduce N and
redesign R TC2 ; if the output voltage decreases over 2mV
as the temperature increases, i.e. V1 - V2 > 2mV,
increase N and redesign R TC2 .
External Temperature Compensation
By pulling the TCOMP pin to GND, the integrated
temperature compensation function is disabled. And one
external temperature compensation network (shown in
Figure 15) can be used to cancel the temperature impact on
the droop (i.e. load line).
ISL6326
between the NTC temperature and the temperature of the
current sense component.
ISL6326 multiplexes the TCOMP factor N with the TM digital
signal to obtain the adjustment gain to compensate the
temperature impact on the sensed channel current. The
compensated channel current signal is used for droop and
overcurrent protection functions.
Design Procedure
1. Properly choose the voltage divider for the TM pin to
°C
COMP
IDROOP
FB
VDIFF
INTERNAL
CIRCUIT
match the TM voltage vs temperature curve with the
recommended curve in Figure 12.
2. Run the actual board under the full load and the desired
cooling condition.
3. After the board reaches the thermal steady state, record
the temperature (T CSC ) of the current sense component
(inductor or MOSFET) and the voltage at TM and VCC
pins.
4. Use Equation 20 to calculate the resistance of the TM
NTC, and find out the corresponding NTC temperature
T NTC from the NTC datasheet.
FIGURE 15. EXTERNAL TEMPERATURE COMPENSATION
The sensed current will flow out of the IDROOP pin and
develop a droop voltage across the resistor equivalent (R FB )
between the FB and VDIFF pins. If R FB resistance reduces
as the temperature increases, the temperature impact on the
droop can be compensated. An NTC resistor can be placed
close to the power stage and used to form R FB . Due to the
non-linear temperature characteristics of the NTC, a resistor
network is needed to make the equivalent resistance
between the FB and VDIFF pins reverse proportional to the
) = --------------------------------
R NTC ( T
NTC
V TM xR TM1
V CC – V TM
(EQ. 20)
temperature.
The external temperature compensation network can only
5. Use Equation 21 to calculate the TCOMP factor N:
compensate the temperature impact on the droop, while it
209x ( T CSC – T
N = -------------------------------------------------------- + 4
NTC
3xT NTC + 400
)
(EQ. 21)
has no impact to the sensed current inside ISL6326.
Therefore, this network cannot compensate for the
temperature impact on the overcurrent protection function.
6. Choose an integral number close to the above result for
the TCOMP factor. If this factor is higher than 15, use
N = 15. If it is less than 1, use N = 1.
7. Choose the pull-up resistor R TC1 (typical 10k Ω ).
8. If N = 15, do not need the pull-down resistor R TC2 ,
otherwise obtain R TC2 by using Equation 22:
Current Sense Output
The current from the IDROOP pin is the sensed average
current inside the ISL6326. In typical application, the
IDROOP pin is connected to the FB pin for the application
where load line is required.
R TC2 = -----------------------
NxR TC1
15 – N
(EQ. 22)
When load line function is not needed, the IDROOP pin can
be used to obtain the load current information: with one
9. Run the actual board under full load again with the proper
resistors connected to the TCOMP pin.
10. Record the output voltage as V1 immediately after the
resistor from the IDROOP pin to GND, the voltage at the
IDROOP pin will be proportional to the load current in
Equation 23:
V IDROOP = ---------------------------- ------------------ I LOAD
R ISEN
output voltage is stable with the full load. Record the
output voltage as V2 after the VR reaches the thermal
steady state.
23
N
R IDROOP R X
(EQ. 23)
FN9262.1
May 5, 2008
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL6326CRZ-TR5453 | 制造商:Intersil Corporation 功能描述:STD. ISL6326CRZ-T W/GOLD BOND WIRE ONLY - Tape and Reel |
| ISL6326IRZ | 功能描述:电流型 PWM 控制器 W/ANNEAL 4-PHS VR11 CNTRLR IND RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| ISL6326IRZ-T | 功能描述:电流型 PWM 控制器 W/ANNEAL 4-PHS VR11 CNTRLR IND RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| ISL6327ACRZ | 功能描述:IC REG CTRLR BUCK PWM 48-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:275kHz 占空比:50% 电源电压:18 V ~ 110 V 降压:无 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:是 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) |
| ISL6327ACRZ-T | 功能描述:IC REG CTRLR BUCK PWM 48-QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:275kHz 占空比:50% 电源电压:18 V ~ 110 V 降压:无 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:是 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 包装:带卷 (TR) |
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