参数资料
| 型号： | ISL78225ANEZ-T |
| 厂商： | Intersil |
| 文件页数： | 22/22页 |
| 文件大小： | 0K |
| 描述： | IC PWM CONTROLLER |
| 标准包装： | 1,000 |
| 系列： | * |
ISL78225
Package Outline Drawing
Q44.10x10A
44 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (EP-TQFP)
Rev 2, 12/10
12.00
4
5
10.00
D 3
3
A
12.00
0.80
B
3
10.00
4.50±0.1
EXPOSED PAD
4
5
4X
0.20 C A-B D
TOP VIEW
4X
0.20 H A-B D
4.50±0.1
BOTTOM VIEW
11/13°
1.20 MAX
7
0.20 M C A-B D
0.05
/ / 0.10 C
0.37 +0.08/-0.07
WITH LEAD FINISH
SIDE VIEW
C
0.10
SEE DETAIL "A"
0.09/0.20
0.09/0.16
0° MIN.
0.35 ±0.05
BASE METAL
1.00 ±0.05
2
(10.00)
0.05/0.15
0.08
R. MIN.
0.20 MIN.
0-7°
0.25
GAUGE
PLANE
(0.45) TYP
DETAIL "A"
SCALE: NONE
(1.00)
0.60 ±0.15
NOTES:
1. All dimensioning and tolerancing conform to ANSI Y14.5-1982.
2. Datum plane H located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting line.
3. Datums A-B and D to be determined at centerline between
10.00
(4.50)
TYPICAL RECOMMENDED LAND PATTERN
22
(4.50)
(1.50) TYP
leads where leads exit plastic body at datum plane H.
4. Dimensions D1 and E1 do not include mold protrusion.
Allowable mold protrusion is 0.254mm on D1 and E1
dimensions.
5. These dimensions to be determined at datum plane H.
6. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
7. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm total in excess of the
b dimension at maximum material condition. Dambar cannot
be located on the lower radius or the foot.
8. Controlling dimension: millimeter.
9. This outline conforms to JEDEC publication 95 registration
MS-026, variation ACB.
10. Dimensions in ( ) are for reference only.
11. The corners of the exposed heatspreader may appear different
due to the presence of the tiebars.
FN7909.3
February 11, 2014
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