参数资料
型号: ISL8126IRZ-TK
厂商: Intersil
文件页数: 37/39页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM VM 32-QFN
标准包装: 1,000
PWM 型: 电压模式
输出数: 2
频率 - 最大: 1.5MHz
占空比: 90%
电源电压: 3 V ~ 5.6 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 32-VFQFN 裸露焊盘
包装: 带卷 (TR)
ISL8126
The critical small components include the bypass capacitors
(C FILTER ) for VCC and PVCC, and many of the components
surrounding the controller including the feedback network and
current sense components. Locate the VCC/PVCC bypass
capacitors as close to the ISL8126 as possible. It is especially
important to locate the components associated with the
feedback circuit close to their respective controller pins, since
they belong to a high-impedance circuit loop, sensitive to EMI
pick-up.
A multi-layer printed circuit board is recommended. Dedicate one
solid layer, usually the one underneath the component side of the
board, for a ground plane and make all critical component
ground connections with vias to this layer. Dedicate another solid
layer as a power plane and break this plane into smaller islands
of common voltage levels. Keep the metal runs from the PHASE
terminal to output inductors short. The power plane should
support the input power and output power nodes. Use copper
filled polygons on the top and bottom circuit layers for the phase
nodes. Use the remaining printed circuit layers for small signal
wiring.
Routing UGATE, LGATE, and PHASE Traces
Great attention should be paid to routing the UGATE, LGATE, and
PHASE traces since they drive the power train MOSFETs using
short, high current pulses. It is important to size them as large
and as short as possible to reduce their overall impedance and
inductance. They should be sized to carry at least one ampere of
current (0.02” to 0.05”). Going between layers with vias should
also be avoided, but if so, use two vias for interconnection when
possible.
Extra care should be given to the LGATE traces in particular since
keeping their impedance and inductance low helps to
significantly reduce the possibility of shoot-through. It is also
important to route each channels UGATE and PHASE traces in as
close proximity as possible to reduce their inductances.
Current Sense Component Placement and
Trace Routing
One of the most critical aspects of the ISL8126 regulator layout
is the placement of the inductor DCR current sense components
and traces. The R-C current sense components must be placed
as close to their respective ISENA and ISENB pins on the ISL8126
as possible.
The sense traces that connect the R-C sense components to each
side of the output inductors should be routed away from the
noisy switching components. These traces should be routed side
by side, and they should be very thin traces. It’s important to
route these traces as far away from any other noisy traces or
planes as possible. These traces should pick up as little noise as
possible. These traces should also originate from the geometric
center of the inductor pin pads and that location should be the
single point of contact the trace makes with its respective net.
37
General PowerPAD Design Considerations
The following is an example of how to use vias to remove heat
from the IC.
FIGURE 34. PCB VIA PATTERN
It is recommended to fill the thermal pad area with vias. A typical
via array fills the thermal pad foot print such that their centers
are 3x the radius apart from each other. Keep the vias small but
not so small that their inside diameter prevents solder wicking
through during reflow.
Connect all vias to the ground plane. It is important the vias have
a low thermal resistance for efficient heat transfer. It is
important to have a complete connection of the plated-through
hole to each plane.
FN7892.1
August 16, 2012
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