参数资料
型号: ISL8130IRZ
厂商: Intersil
文件页数: 16/24页
文件大小: 0K
描述: IC REG CTRLR BST FLYBK PWM 20QFN
标准包装: 75
PWM 型: 电压模式
输出数: 1
频率 - 最大: 1.4MHz
占空比: 100%
电源电压: 4.5 V ~ 5.5 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 20-VFQFN 裸露焊盘
包装: 管件
ISL8130
threshold. A Kelvin connection is recommended to avoid noise
coupling.
In a buck configuration, the OC trip point varies mainly due to the
upper MOSFETs r DS(ON) variations. To avoid overcurrent tripping in
the normal operating load range, find the R OCSET resistor from
Equation 1 with:
1. The maximum r DS(ON) at the highest junction temperature.
2. Determine I OC for I OC > I OUT ( MAX ) + ( Δ I ) ? 2 ,
where Δ I is the output inductor ripple current.
A small ceramic capacitor should be placed in parallel with
R OCSET to smooth the voltage across R OCSET in the presence of
switching noise on the input voltage. Both the R OCSET and the
filtering cap should be placed close to the ISL8130.
The OCP function is active once the ENSs reaches the enable
threshold voltage.
Over-Temperature Protection
The ISL8130 is protected against over-temperature conditions.
When the junction temperature exceeds +150°C, the PWM shuts
off. Normal operation is resumed when the junction temperature
decreases to 130°C.
Undervoltage
If the voltage on the FB pin is less than 85% of the reference
voltage for 8 consecutive PWM cycles, then the circuit enters into
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using wide,
short printed circuit traces. The critical components should be
located as close together as possible using ground plane
construction or single point grounding.
Figure 29 shows the critical power components of the buck
converter. To minimize the voltage overshoot the interconnecting
wires indicated by heavy lines should be part of ground or power
plane in a printed circuit board. The components shown in
Figure 29 should be located as close together as possible. Please
note that the capacitors C IN and C O each represent numerous
physical capacitors. Locate the ISL8130 within 3 inches of the
MOSFETs, Q 1 and Q 2 . The circuit traces for the MOSFETs’ gate
and source connections from the ISL8130 must be sized to
handle up to 1A peak current.
VIN
ISL8130
soft-start hiccup mode. This mode is identical to the overcurrent
hiccup mode. This undervoltage protection is disabled if the
ENSS does not reach 3.3V.
UGATE
PHASE
Q1
L O
V OUT
Overvoltage Protection
If the voltage on the FB pin exceeds the reference voltage by 15%,
LGATE
Q2
D2
C IN
C O
the lower gate driver is turned on continuously to discharge the
output voltage. If the overvoltage condition continues for 32
consecutive PWM cycles, then the chip is turned off with the gate
drivers tri-stated. The voltage on the FB pin will fall and reach the
15% undervoltage threshold. After 8 clock cycles, the chip will
enter soft-start hiccup mode. This mode is identical to the
overcurrent hiccup mode. This overvoltage protection is disabled
if the ENSS does not reach 3.3V.
Gate Control Logic
The gate control logic translates PWM control signals into the
MOSFET gate drive signals providing necessary amplification,
level shifting and shoot-through protection. Also, it has functions
that help optimize the IC performance over a wide range of
operational conditions.
Since MOSFET switching time can vary dramatically from type to
type and with the input voltage, the gate control logic provides
adaptive dead time by monitoring the gate-to-source voltages of
both upper and lower MOSFETs. The lower MOSFET is not turned
on until the gate-to-source voltage of the upper MOSFET has
decreased to less than approximately 1V. Similarly, the upper
MOSFET is not turned on until the gate-to-source voltage of the
lower MOSFET has decreased to less than approximately 1V. This
allows a wide variety of upper and lower MOSFETs to be used
without a concern for simultaneous conduction, or shoot-through.
In a boost converter configuration, the LGATE signal may be left
floating.
16
GND
RETURN
FIGURE 29. PRINTED CIRCUIT BOARD POWER AND GROUND
PLANES OR ISLANDS
Figure 30 shows the circuit traces that require additional layout
consideration. Use single point and ground plane construction for
the circuits shown. Minimize any leakage current paths on the SS
PIN and locate the capacitor, C ss close to the SS pin because the
internal current source is only 10μA. Provide local V CC
decoupling between VCC and GND pins. Locate the capacitor,
C BOOT as close as practical to the BOOT and PHASE pins.
FN7954.3
October 5, 2012
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