参数资料
| 型号： | ISL8500IRZ-T |
| 厂商： | Intersil |
| 文件页数： | 14/15页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK ADJ 2A 12DFN |
| 产品培训模块： | Solutions for Industrial Control Applications |
| 标准包装： | 6,000 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.6 V ~ 19 V |
| 输入电压： | 4.5 V ~ 25 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 500kHz |
| 电流 - 输出： | 2A |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 12-VFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 12-DFN（4x3） |
ISL8500
A more detailed explanation of voltage mode control of a
buck regulator can be found in TB417, entitled “Designing
Stable Compensation Networks for Single Phase Voltage
Mode Buck Regulators.”
VIN
V IN
C IN
Layout Considerations
Layout is very important in high frequency switching
converter design. With power devices switching efficiently
between 100kHz and 600kHz, the resulting current
5V
C BP1
VDD
ISL8500
PHASE
GND
D
L
C OUT1
V OUT1
transitions from one device to another cause voltage spikes
across the interconnecting impedances and parasitic circuit
COMP
C 2
elements. These voltage spikes can degrade efficiency,
radiate noise into the circuit, and lead to device overvoltage
stress. Careful component layout and printed circuit board
design minimizes these voltage spikes.
FB
R 2
R 4
C 1
R 1
C 3
R 3
As an example, consider the turn-off transition of the upper
MOSFET. Prior to turn-off, the MOSFET is carrying the full load
current. During turn-off, current stops flowing in the MOSFET
and is picked up by the Schottky diode. Any parasitic
inductance in the switched current path generates a large
voltage spike during the switching interval. Careful component
selection, tight layout of the critical components, and short, wide
traces minimizes the magnitude of voltage spikes.
There are two sets of critical components in the ISL8500
switching converter. The switching components are the most
critical because they switch large amounts of energy, and
therefore tend to generate large amounts of noise. Next are
the small signal components, which connect to sensitive
nodes or supply critical bypass current and signal coupling.
A multi-layer printed circuit board is recommended. Figure 23
shows the connections of the critical components in the
converter. Note that capacitors C IN and C OUT could each
represent numerous physical capacitors. Dedicate one solid
layer, usually a middle layer of the PC board, for a ground
plane and make all critical component ground connections
with vias to this layer. Dedicate another solid layer as a power
plane and break this plane into smaller islands of common
voltage levels. Keep the metal runs from the PHASE terminals
to the output inductor short. The power plane should support
the input power and output power nodes. Use copper filled
polygons on the top and bottom circuit layers for the phase
nodes. Use the remaining printed circuit layers for small signal
wiring.
In order to dissipate heat generated by the internal LDO and
MOSFET, the ground pad, pin 13, should be connected to
the internal ground plane through at least four vias. This
allows the heat to move away from the IC and also ties the
pad to the ground plane through a low impedance path.
The switching components should be placed close to the
ISL8500 first. Minimize the length of the connections
between the input capacitors, C IN , and the power switches
by placing them nearby. Position both the ceramic and bulk
input capacitors as close to the upper MOSFET drain as
14
GND PAD
KEY
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT AND/OR POWER PLANE LAYER
VIA CONNECTION TO GROUND PLANE
FIGURE 23. PRINTED CIRCUIT BOARD POWER PLANES AND
ISLANDS
possible. Position the output inductor and output capacitors
between the upper and Schottky diode and the load.
The critical small signal components include any bypass
capacitors, feedback components, and compensation
components. Place the PWM converter compensation
components close to the FB and COMP pins. The feedback
resistors should be located as close as possible to the FB
pin with vias tied straight to the ground plane as required.
FN6611.0
December 10, 2007
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL8501EVAL1Z | 功能描述:EVALUATION BOARD FOR ISL8501 RoHS:是 类别:编程器，开发系统 >> 评估板 - DC/DC 与 AC/DC（离线）SMPS 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC，步升 输出及类型:1，非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969 |
| ISL8501IRZ | 功能描述:电压模式 PWM 控制器 INTEGRTD FETUCK 4X 4 24LD W/ANNEAL RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
| ISL8501IRZ-T | 功能描述:电压模式 PWM 控制器 INTEGRTD FETUCK 4X 4 24LD W/ANNEAL RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel |
| ISL8502AEVAL1Z | 功能描述:EVAL BOARD FOR ISL8502 RoHS:是 类别:编程器，开发系统 >> 评估板 - DC/DC 与 AC/DC（离线）SMPS 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:True Shutdown™ 主要目的:DC/DC，步升 输出及类型:1，非隔离 功率 - 输出:- 输出电压:- 电流 - 输出:1A 输入电压:2.5 V ~ 5.5 V 稳压器拓扑结构:升压 频率 - 开关:3MHz 板类型:完全填充 已供物品:板 已用 IC / 零件:MAX8969 |
| ISL8502AIRZ | 功能描述:IC REG BUCK SYNC ADJ 2A 24QFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:- 类型:降压（降压） 输出类型:两者兼有 输出数:1 输出电压:5V，1 V ~ 10 V 输入电压:3.5 V ~ 28 V PWM 型:电流模式 频率 - 开关:220kHz ~ 1MHz 电流 - 输出:600mA 同步整流器:无 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:16-SSOP（0.154"，3.90mm 宽） 包装:带卷 (TR) 供应商设备封装:16-QSOP |
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