参数资料
| 型号： | ISL9112IRT7Z-T7A |
| 厂商： | Intersil |
| 文件页数： | 18/20页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK BOOST SYNC 5V 12TDFN |
| 标准包装： | 1 |
| 类型： | 降压（降压），升压（升压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 5V |
| 输入电压： | 1.8 V ~ 5.5 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 2.5MHz |
| 电流 - 输出： | 1.2A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 12-WFDFN 裸露焊盘 |
| 包装： | 标准包装 |
| 供应商设备封装： | 12-TDFN-EP（3x3） |
| 其它名称： | ISL9112IRT7Z-T7ADKR |
ISL9110, ISL9112
Application Example 1.
An application using the fixed-output ISL9110IRTNZ is shown in
Figure 34. This application requires only three external
components.
LX1
FB
V IN =
1.8V TO 5.5V
C1
10μF
STATUS
OUTPUTS
5
6
10
9
8
7
ISL9110IRTNZ
PVIN
VIN LX2
MODE VOUT
EN
BAT
PG
4
2
1
12
L1
2.2μH
V OUT =
3.3V/1A
C2
10μF
FIGURE 34. TYPICAL ISL9110IRTNZ APPLICATION
Application Example 2.
An application requiring V OUT = 3.0V, using the adjustable-output
ISL9110IRTAZ is shown in Figure 35. This application requires six
external components.
LX2
VIN
MODE
VOUT
EN
BAT
7
V IN =
1.8V TO 5.5V
C1
10μF
STATUS
OUTPUTS
ISL9110IRTAZ
5 PVIN LX1
6
10
9
8
FB
PG
4
2
1
12
L1
2.2μH
R1
1M
R2
365k
C4
56pF
V OUT =
3.0V/1A
C2
10μF
FIGURE 37. RECOMMENDED PCB LAYOUT
The TDFN Package Requires Additional PCB
Layout Rules for the Thermal Pad
The thermal pad is electrically connected to the PGND supply. Its
FIGURE 35. TYPICAL ISL9110IRTAZ APPLICATION
Application Example 3.
An application requiring V OUT = 3.3V, using the I 2 C-controllable
ISL9112IRTNZ is shown in Figure 36. This application requires
three external components. Output voltage can be changed via
I 2 C control.
primary function is to provide heat sinking for the IC. However,
because of the connection to PGND, the thermal pad must be
tied to the GND supply to prevent unwanted current flow to the
thermal pad. Maximum AC performance is achieved if the
thermal pad is attached to a dedicated ground layer in a
multi-layered PC board.
The thermal pad requirements are proportional to power
FB
V IN =
1.8V TO 5.5V
C1
10μF
I 2 C
BUS
5
6
10
9
8
7
ISL9112IRTNZ
PVIN LX1
VIN LX2
MODE VOUT
EN
SDA
SCL
4
2
1
12
L1
2.2μH
V OUT =
3.3V/1A
C2
10μF
dissipation and ambient temperature. A dedicated layer
eliminates the need for individual thermal pad area. When a
dedicated layer is not possible, an isolated thermal pad on
another layer should be used. Pad area requirements should be
evaluated on a case by case basis.
General PowerPAD Design Considerations
The following is an example of how to use vias to remove heat
from the IC.
FIGURE 36. TYPICAL ISL9112IRTNZ APPLICATION
Recommended PCB Layout
Correct PCB layout is critical for proper operation of the ISL9110.
The input and output capacitors should be positioned as closely
to the IC as possible. The ground connections of the input and
output capacitors should be kept as short as possible, and
should be on the component layer to avoid problems that are
caused by high switching currents flowing through PCB vias.
18
FIGURE 38. PCB VIA PATTERN
FN7649.2
July 13, 2012
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL9112IRTNEVAL1Z | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:1.2A High Efficiency Buck-Boost Regulators |
| ISL9112IRTNZ | 制造商:Intersil Corporation 功能描述: 制造商:Intersil Corporation 功能描述:1.2A SINGLE INDUCTOR BUCK-BOOST, 3.3V, 12LD 3X3 EP TDFN - Trays |
| ISL9112IRTNZ-EVAL1Z | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:1.2A High Efficiency Buck-Boost Regulators Output Current: Up to 1.2A |
| ISL9112IRTNZ-T | 制造商:Intersil Corporation 功能描述:1.2A SINGLE INDUCTOR BUCK-BOOST, 3.3V, 12LD 3X3 EP TDFN - Tape and Reel |
| ISL9112IRTNZ-T7A | 功能描述:IC REG BUCK BST SYNC 3.3V 12TDFN RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 标准包装:1 系列:EZBuck™ 类型:降压（降压） 输出类型:可调式 输出数:1 输出电压:0.8 V ~ 22.1 V 输入电压:3 V ~ 26 V PWM 型:电流模式 频率 - 开关:1.5MHz 电流 - 输出:1.8A 同步整流器:无 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 包装:剪切带 (CT) 供应商设备封装:8-DFN（2x2） 其它名称:785-1276-1 |
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