参数资料
型号: KIT33886DHEVB
厂商: Freescale Semiconductor
文件页数: 19/28页
文件大小: 0K
描述: KIT EVAL FOR MC33886 H-BRIDGE
标准包装: 1
主要目的: 电源管理,H 桥驱动器(内部 FET)
嵌入式:
已用 IC / 零件: MC33886
主要属性: 5?V ~ 40?V 电源,5A 输出
次要属性: 短路、热和欠压保护
已供物品: 板,CD
相关产品: MC33886VWR2-ND - IC H-BRIDGE 5.0A 20-HSOP
MC33886DHR2-ND - IC H-BRIDGE 5.0A 20-HSOP
MC33886VW-ND - IC H-BRIDGE 5.0A OUTPUT 20-HSOP
MC33886DH-ND - IC H-BRIDGE 5.0A OUTPUT 20-HSOP
FUNCTIONAL DEVICE OPERATION
PERFORMANCE
PERFORMANCE
The 33886 is designed for enhanced thermal performance.
The significant feature of this device is the exposed copper
pad on which the power die is soldered. This pad is soldered
on a PCB to provide heat flow to ambient and also to provide
thermal capacitance. The more copper area on the PCB, the
better the power dissipation and transient behavior will be.
Example Characterization on a double-sided PCB: bottom
side area of copper is 7.8 cm 2 ; top surface is 2.7 cm 2 (see
Figure 21 ); grid array of 24 vias 0.3 mm in diameter.
Figure 22 shows the thermal response with the device
soldered on to the test PCB described in Figure 21 .
100
10
Rth (?¨DóC
1
0,1
0,001
0,01
0,1
1
10
t, Time (s)
100
1000
10000
Figure 22. 33886 Thermal Response
Top Side
Bottom Side
Figure 21. PCB Test Layout
33886
Analog Integrated Circuit Device Data ?
Freescale Semiconductor
19
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相关代理商/技术参数
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