参数资料
型号: KIT33886DHEVB
厂商: Freescale Semiconductor
文件页数: 25/28页
文件大小: 0K
描述: KIT EVAL FOR MC33886 H-BRIDGE
标准包装: 1
主要目的: 电源管理,H 桥驱动器(内部 FET)
嵌入式:
已用 IC / 零件: MC33886
主要属性: 5?V ~ 40?V 电源,5A 输出
次要属性: 短路、热和欠压保护
已供物品: 板,CD
相关产品: MC33886VWR2-ND - IC H-BRIDGE 5.0A 20-HSOP
MC33886DHR2-ND - IC H-BRIDGE 5.0A 20-HSOP
MC33886VW-ND - IC H-BRIDGE 5.0A OUTPUT 20-HSOP
MC33886DH-ND - IC H-BRIDGE 5.0A OUTPUT 20-HSOP
5.0 A H-BRIDGE
THERMAL ADDENDUM - REVISION 2.0
A
AGND
FS
IN1
V+
V+
OUT1
OUT1
DNC
PGND
PGND
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DNC
IN2
D1
C CP
V+
OUT2
OUT2
D2
PGND
PGND
33886 Pin Connections
20-Pin HSOP
1.27 mm Pitch
16.0 mm x 11.0 mm Body
12.2 mm x 6.9 mm Exposed Pad
Figure 25. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
Table 8.
Thermal Resistance Performance
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Thermal
Resistance
Area A (mm 2 )
? C/W
Outline:
Area A :
Ambient Conditions:
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
Natural convection, still air
R ? JA
R ? JS
0.0
300
600
0.0
300
52
36
32
10
7.0
600
6.0
R ? JA ? is the thermal resistance between die junction and
ambient air.
R ? JS is the thermal resistance between die junction and the
reference location on the board surface near a center lead of the
package (see Figure 25 ).
33886
Analog Integrated Circuit Device Data ?
Freescale Semiconductor
25
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