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| 型号： | KIT33886DHEVB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 5/28页 |
| 文件大小： | 0K |
| 描述： | KIT EVAL FOR MC33886 H-BRIDGE |
| 标准包装： | 1 |
| 主要目的： | 电源管理，H 桥驱动器（内部 FET） |
| 嵌入式： | 否 |
| 已用 IC / 零件： | MC33886 |
| 主要属性： | 5?V ~ 40?V 电源，5A 输出 |
| 次要属性： | 短路、热和欠压保护 |
| 已供物品： | 板，CD |
| 相关产品： | MC33886VWR2-ND - IC H-BRIDGE 5.0A 20-HSOP MC33886DHR2-ND - IC H-BRIDGE 5.0A 20-HSOP MC33886VW-ND - IC H-BRIDGE 5.0A OUTPUT 20-HSOP MC33886DH-ND - IC H-BRIDGE 5.0A OUTPUT 20-HSOP |
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Supply Voltage
Input Voltage (1)
Rating
Symbol
V+
V IN
Value
40
-0.1 to 7.0
Unit
V
V
FS Status Output
V FS
7.0
V
Continuous Current (3)
ESD Voltage for VW Package
I OUT
5.0
A
V
Human Body Model
Machine Model (5)
V ESD1
V ESD2
±2000
±200
Storage Temperature
T STG
-65 to 150
? C
Ambient Operating Temperature
Operating Junction Temperature
T A
T J
-40 to 125
-40 to 150
? C
? C
Peak Package Reflow Temperature During Reflow
T PPRT
°C
Approximate Junction-to-Board Thermal Resistance (and Package
Dissipation = 6.0 W) (9)
R ? JB
~5.0
? C/W
Notes
1.
2.
3.
4.
5.
6.
7.
9.
Exceeding the input voltage on IN1, IN2, D1, or D2 may cause a malfunction or permanent damage to the device.
Exceeding the pull-up resistor voltage on the open drain FS pin may cause permanent damage to the device.
Continuous current capability so long as junction temperature is ? 150 ? C.
ESD1 testing is performed in accordance with the Human Body Model (C ZAP = 100 pF, R ZAP = 1500 ? ).
ESD2 testing is performed in accordance with the Machine Model (C ZAP = 200 pF, R ZAP = 0 ? ).
The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heatsinking.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual R ? JB (junction-to-PC board)
values will vary depending on solder thickness and composition and copper trace.
33886
Analog Integrated Circuit Device Data ?
Freescale Semiconductor
5
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