参数资料
型号: LC4512B-35FN256C
厂商: LATTICE SEMICONDUCTOR CORP
元件分类: PLD
中文描述: EE PLD, 3.5 ns, PBGA256
封装: LEAD FREE, FPBGA-256
文件页数: 7/99页
文件大小: 441K
代理商: LC4512B-35FN256C
Lattice Semiconductor
ispMACH 4000V/B/C/Z Family Data Sheet
15
Absolute Maximum Ratings
1, 2, 3
ispMACH 4000C/Z
ispMACH 4000B
ispMACH 4000V
(1.8V)
(2.5V)
(3.3V)
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . -0.5 to 2.5V . . . . . . . . . .-0.5 to 5.5V.. . . . . . . . . . -0.5 to 5.5V
Output Supply Voltage (VCCO) . . . . . . . . . . . . . . . -0.5 to 4.5V . . . . . . . . . .-0.5 to 4.5V.. . . . . . . . . . -0.5 to 4.5V
Input or I/O Tristate Voltage Applied
4, 5 . . . . . . . . . -0.5 to 5.5V . . . . . . . . . .-0.5 to 5.5V.. . . . . . . . . . -0.5 to 5.5V
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . -65 to 150°C. . . . . . . . . -65 to 150°C. . . . . . . . . .-65 to 150°C
Junction Temperature (Tj) with Power Applied . . . -55 to 150°C. . . . . . . . . -55 to 150°C. . . . . . . . . .-55 to 150°C
1. Stress above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or any other conditions above those indicated in the operational sections of this specication
is not implied.
2. Compliance with Lattice Thermal Management document is required.
3. All voltages referenced to GND.
4. Undershoot of -2V and overshoot of (VIH (MAX) + 2V), up to a total pin voltage of 6.0V, is permitted for a duration of < 20ns.
5. Maximum of 64 I/Os per device with VIN > 3.6V is allowed.
Recommended Operating Conditions
Erase Reprogram Specications
Hot Socketing Characteristics
1,2,3
Symbol
Parameter
Min.
Max.
Units
VCC
Supply Voltage for 1.8V Devices
ispMACH 4000C
1.65
1.95
V
ispMACH 4000Z
1.7
1.9
V
ispMACH 4000Z, Extended Functional Voltage
Operation
1.6
1, 2
1.9
V
Supply Voltage for 2.5V Devices
2.3
2.7
V
Supply Voltage for 3.3V Devices
3.0
3.6
V
Tj
Junction Temperature (Commercial)
0
90
C
Junction Temperature (Industrial)
-40
105
C
Junction Temperature (Extended)
-40
130
C
1. Devices operating at 1.6V can expect performance degradation up to 35%.
2. Applicable for devices with 2004 date codes and later. Contact factory for ordering instructions.
Parameter
Min.
Max.
Units
Erase/Reprogram Cycle
1,000
Cycles
Note: Valid over commercial temperature range.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
IDK
Input or I/O Leakage Current
0 ≤ VIN ≤ 3.0V, Tj = 105°C
±30
±150
A
0 ≤ VIN ≤ 3.0V, Tj = 130°C
±30
±200
A
1. Insensitive to sequence of VCC or VCCO. However, assumes monotonic rise/fall rates for VCC and VCCO, provided (VIN - VCCO) ≤ 3.6V.
2. 0 < VCC < VCC (MAX), 0 < VCCO < VCCO (MAX).
3. IDK is additive to IPU, IPD or IBH. Device defaults to pull-up until fuse circuitry is active.
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