参数资料
型号: LP5521TMEV
厂商: National Semiconductor
文件页数: 4/44页
文件大小: 0K
描述: EVAL BOARD FOR LP5521
标准包装: 1
系列: *
其它名称: Q5109809

SNVS441F – JANUARY 2007 – REVISED FEBRUAY 2013
PIN DESCRIPTIONS LP5521YQ (continued)
Pin #
24
Name
CFLY1N
Type (1)
A
Description
Negative terminal of charge pump fly capacitor 1
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2) (3)
V(V DD , V OUT , R, G, B)
Voltage on Logic Pins
Continuous Power Dissipation (4)
Junction Temperature (T J-MAX )
Storage Temperature Range
Maximum Lead Temperature (Soldering)
-0.3V to +6.0V
-0.3V to V DD +0.3V with 6.0V
max
Internally Limited
125°C
-65°C to +150°C
(5)
ESD Rating
(6)
Human Body Model
Machine Model
2 kV
200V
(1)
(2)
(3)
(4)
(5)
(6)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pins.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T J = 150°C (typ.) and
disengages at T J = 130°C (typ.).
For detailed soldering specifications and information, please refer to Texas Instruments Application Note AN1112 : DSBGA Wafer Level
Chip Scale Package or AN1187 : Leadless Leadframe Package (LLP).
The Human body model is a 100 pF capacitor discharged through a 1.5 k ? resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
OPERATING RATINGS (1) (2)
V DD
Recommended Charge Pump Load Current I OUT
Junction Temperature (T J ) Range
Ambient Temperature (T A ) Range (3)
2.7 to 5.5V
0 to 100 mA
-30°C to +125°C
-30°C to +85°C
(1)
(2)
(3)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the potential at the GND pins.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T A-MAX ) is dependent on the maximum operating junction temperature (T J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P D-MAX ), and the junction-to ambient thermal resistance of the
part/package in the application ( θ JA ), as given by the following equation: T A-MAX = T J-MAX-OP – ( θ JA × P D-MAX ).
THERMAL PROPERTIES
Junction-to-Ambient Thermal Resistance ( θ JA ), YFQ0020 Package (1)
50 - 90°C/W
Junction-to-Ambient Thermal Resistance ( θ JA ), NJA0024A Package
(1)
37 - 90°C/W
(1)
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
4
Product Folder Links: LP5521
Copyright ? 2007–2013, Texas Instruments Incorporated
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