参数资料
型号: LT3581EMSE#PBF
厂商: Linear Technology
文件页数: 34/36页
文件大小: 0K
描述: IC REG MULTI CONFIG ADJ 16MSOP
标准包装: 37
类型: 升压(升压),反相,回扫,Sepic
输出类型: 可调式
输出数: 1
输出电压: 1.22 V ~ 42 V
输入电压: 2.5 V ~ 22 V
PWM 型: 电流模式
频率 - 开关: 200kHz ~ 2.5MHz
电流 - 输出: 3.3A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 16-TFSOP(0.118",3.00mm 宽)裸露焊盘
包装: 管件
供应商设备封装: 16-MSOP,裸露焊盘
LT3581
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
DE Package
14-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1708 Rev B)
0.70 ± 0.05
4.00 ± 0.10
(2 SIDES)
R = 0.05
TYP
8
R = 0.115
TYP
14
0.40 ± 0.10
3.60 ± 0.05
2.20 ± 0.05
3.30 ± 0.05
1.70 ± 0.05
3.00 REF
0.25 ± 0.05
0.50 BSC
PACKAGE
OUTLINE
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ± 0.10
(2 SIDES)
0.75 ± 0.05
3.30 ± 0.10
1.70 ± 0.10
7
3.00 REF
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45 °
CHAMFER
(DE14) DFN 0806 REV B
1
0.25 ± 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
34
0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
For more information www.linear.com/LT3581
3581fa
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