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参数资料
| 型号： | LX1562IDM-TR |
| 厂商： | MICROSEMI CORP-ANALOG MIXED SIGNAL GROUP |
| 元件分类： | 稳压器 |
| 英文描述： | 0.5 A POWER FACTOR CONTROLLER, PDSO8 |
| 封装： | ROHS COMPLIANT, PLASTIC, SOIC-8 |
| 文件页数： | 12/25页 |
| 文件大小： | 430K |
| 代理商： | LX1562IDM-TR |
SECOND-GENERATION POWER FACTOR C ONTROLLER
LX1562/1563
PRODUCT DA T ABOOK 1996/1997
Copyright 1996
Rev. 1.3a
8/30
2
P RODUCTION D ATA
S HEET
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage (V
IN) ...................................................................................... -0.3V to 28V
Peak Driver Output Current (Note 3) ................................................................. ±500mA
Driver Output Clamping Diodes
V
O > VCC or VO < -0.3V ........................................................................................ ±10mA
Detector Clamping Diodes
V
DET > 6V or VDET < 0.9V ..................................................................................... ±10mA
Error Amp, Multiplier, and Comparator Input Voltages ................................ -0.3V to 6V
Detector Input Voltage (Note 2) ....................................................................... -0.3 to 6V
Operating Junction Temperature
Plastic (M and DM Packages) ............................................................................... 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................ 300°C
PACKAGE PIN OUTS
V
IN
OUT
GROUND
I
DET
E.A. INV.
E.A. OUT
MULT. INPUT
C.S.
1
8
27
36
45
M PACKAGE
(Top View)
DM PACKAGE
(Top View)
V
IN
OUT
GROUND
I
DET
E.A. INV.
E.A. OUT
MULT. INPUT
C.S.
1
8
27
36
45
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
Note 2. With no limiting resistor.
Note 3. Current duty cycle is chosen such that T
J is below 150°C.
THERMAL DATA
M PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
95°C/W
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
165°C/W
Junction Temperature Calculation:
T
J = TA + (PD x θJA).
The
θ
JA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
Pb-free / RoHS Peak Package Solder Reflow Temp (40 second max. exposure)...............260°C (+0, -5)
RoHS / Pb-free 100% Matte Tin Lead Finish
O
B
SO
LETE
PRO
D
UCT
NOT
RECOMMENDED
FOR
NEW
DESIGNS
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