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参数资料
型号： M1A3PE1500-FGG484
厂商： Microsemi SoC
文件页数： 62/162页
文件大小： 0K
描述： IC FPGA 1KB FLASH 1.5M 484-FBGA
标准包装： 40
系列： ProASIC3E
RAM 位总计： 276480
输入/输出数： 280
门数： 1500000
电源电压： 1.425 V ~ 1.575 V
安装类型： 表面贴装
工作温度： 0°C ~ 70°C
封装/外壳： 484-BGA
供应商设备封装： 484-FPBGA（23x23）
Datasheet Information
5-4
Revision 13
Revision
Changes
Page
Revision 9 (Aug 2009)
Product Brief v1.2
All references to speed grade –F have been removed from this document.
N/A
The "Pro I/Os with Advanced I/O Standards" section was revised to add
definitions of hot-swap and cold-sparing.
1-6
DC
and
Switching
Characteristics v1.3
3.3 V LVCMOS and 1.2 V LVCMOS Wide Range support was added to the
datasheet. This affects all tables that contained 3.3 V LVCMOS and 1.2 V
LVCMOS data.
N/A
IIL and IIH input leakage current information was added to all "Minimum and
Maximum DC Input and Output Levels" tables.
N/A
–F was removed from the datasheet. The speed grade is no longer supported.
N/A
In the Table 2-2 Recommended Operating Conditions 1 "3.0 V DC supply
voltage" and note 4 are new.
2-2
The Table 2-4 Overshoot and Undershoot Limits 1 table was updated.
2-3
The Table 2-6 Temperature and Voltage Derating Factors for Timing Delays
table was updated.
2-5
There are new parameters and data was updated in the Table 2-99 RAM4K9
table.
2-75
There are new parameters and data was updated in the Table 2-100
RAM512X18 table.
2-76
Revision 8 (Feb 2008)
Product Brief v1.1
Table 1-2 ProASIC3E FPGAs Package Sizes Dimensions is new.
1-II
Revision 7 (Jun 2008)
DC
and
Switching
Characteristics v1.2
The title of Table 2-4 Overshoot and Undershoot Limits 1 was modified to
remove "as measured on quiet I/Os." Table note 2 was revised to remove
"estimated SSO density over cycles." Table note 3 was deleted
.
2-3
Table 2-78 LVDS Minimum and Maximum DC Input and Output Levels was
updated.
2-49
Revision 6 (Jun 2008) The A3PE600 "FG484" table was missing G22. The pin and its function were
added to the table.
4-17
Revision 5 (Jun 2008)
Packaging v1.4
The naming conventions changed for the following pins in the "FG484" for the
A3PE600:
Pin Number
New Function Name
J19
IO45PPB2V1
K20
IO45NPB2V1
M2
IO114NPB6V1
N1
IO114PPB6V1
N4
GFC2/IO115PPB6V1
P3
IO115NPB6V1
4-17
Revision 4 (Apr 2008)
Product Brief v1.0
The product brief portion of the datasheet was divided into two sections and given
a version number, starting at v1.0. The first section of the document includes
features, benefits, ordering information, and temperature and speed grade
offerings. The second section is a device family overview.
N/A
Packaging v1.3
The "FG324" package diagram was replaced.
4-12
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相关代理商/技术参数
参数描述
M1A3PE1500-FGG484I 功能描述:IC FPGA 1KB FLASH 1.5M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
M1A3PE1500-FGG676 功能描述:IC FPGA 1KB FLASH 1.5M 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
M1A3PE1500-FGG676I 功能描述:IC FPGA 1KB FLASH 1.5M 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
M1A3PE1500-FGG896 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
M1A3PE1500-FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
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