参数资料
型号: M1A3PE1500-FGG484
厂商: Microsemi SoC
文件页数: 67/162页
文件大小: 0K
描述: IC FPGA 1KB FLASH 1.5M 484-FBGA
标准包装: 40
系列: ProASIC3E
RAM 位总计: 276480
输入/输出数: 280
门数: 1500000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 484-BGA
供应商设备封装: 484-FPBGA(23x23)
ProASIC3E Flash Family FPGAs
Revision 13
5-9
Advance v0.5
(continued)
The "I/O User Input/Output" pin description was updated to include information on
what happens when the pin is unused.
2-50
The "JTAG Pins" section was updated to include information on what happens
when the pin is unused.
2-51
The "Programming" section was updated to include information concerning
serialization.
2-53
The "JTAG 1532" section was updated to include SAMPLE/PRELOAD
information.
2-54
The "DC and Switching Characteristics" chapter was updated with new
information.
Starting
on page
3-1
Table 3-6 was updated.
3-5
In Table 3-10, PAC4 was updated.
3-8
Table 3-19 was updated.
3-20
The note in Table 3-24 was updated.
3-23
All Timing Characteristics tables were updated from LVTTL to Register Delays
3-26 to
3-64
The Timing Characteristics for RAM4K9, RAM512X18, and FIFO were updated.
3-74 to
3-79
FTCKMAX was updated in Table 3-98.
3-80
Advance v0.4
(October 2005)
The "Packaging Tables" table was updated.
ii
Advance v0.3
Figure 2-11 was updated.
2-9
The "Clock Resources (VersaNets)" section was updated.
2-9
The "VersaNet Global Networks and Spine Access" section was updated.
2-9
The "PLL Macro" section was updated.
2-15
Figure 2-27 was updated.
2-28
Figure 2-20 was updated.
2-19
Table 2-5 was updated.
2-25
Table 2-6 was updated.
2-25
The "FIFO Flag Usage Considerations" section was updated.
2-27
Table 2-33 was updated.
2-51
Figure 2-24 was updated.
2-31
The "Cold-Sparing Support" section is new.
2-34
Table 2-45 was updated.
2-64
Table 2-48 was updated.
2-81
Pin descriptions in the "JTAG Pins" section were updated.
2-51
The "Pin Descriptions" section was updated.
2-50
Table 3-7 was updated.
3-6
Revision
Changes
Page
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M1A3PE1500-FGG484I 功能描述:IC FPGA 1KB FLASH 1.5M 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
M1A3PE1500-FGG676 功能描述:IC FPGA 1KB FLASH 1.5M 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
M1A3PE1500-FGG676I 功能描述:IC FPGA 1KB FLASH 1.5M 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
M1A3PE1500-FGG896 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
M1A3PE1500-FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs