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参数资料
| 型号： | MA4P606-36 |
| 元件分类： | 参考电压二极管 |
| 英文描述： | SILICON, PIN DIODE |
| 封装： | HERMETIC SEALED PACKAGE-2 |
| 文件页数： | 6/7页 |
| 文件大小： | 365K |
| 代理商： | MA4P606-36 |
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)) or
information contained herein without notice.
ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for
development. Performance is based on target specifications, simulated results, and/or prototype
measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
volume is not guaranteed.
Packaged PIN Diodes
RoHS Compliant
Rev V.6
Inspection
Method
Condition
Storage
Temperature
1031
See Maximum Ratings
Operating
Temperature
——
See Maximum Ratings
Temperature
Cycling
1051
5 cycles
- 65°C to +150°C
Shock
2016
500g’s
Vibration
2056
15g’s
Constant
Acceleration
2006
20,000g’s
Humidity
1021
10 Days
Recommended Groups B&C Testing
Per MIL-STD 750
Recommended methods and conditions for
Groups B and C, TX and TXV level screening.
Inspection
Method
Condition
Internal Visual
and / or X-Ray
2072, 2076
See Note
High Temp.
Storage
1032
48 hours minimum @
max. storage temp.
Thermal Shock
1051
10 Cycles
Constant
Acceleration
2006
20,000 g's, Y1
Fine Leak
1071
H
Gross Leak
1071
C or E
Electrical
——
See Note
Burn-In
1038
See Note
Notes:
1. Conditions and details of test depend on specific model number. Information available upon request.
2. Case styles 1056 and 1088 are not military, MIL-STD-750, rated packages.
Recommended Screening
Per MIL-STD 750
Recommended methods and conditions
f
for TX and TXV level screening.
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