参数资料
型号: MAX1183ECM+TD
厂商: Maxim Integrated Products
文件页数: 11/18页
文件大小: 0K
描述: IC ADC 10BIT 40MSPS DL 48-TQFP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,000
位数: 10
采样率(每秒): 40M
数据接口: 并联
转换器数目: 2
功率耗散(最大): 180mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 48-TQFP 裸露焊盘
供应商设备封装: 48-TQFP 裸露焊盘(7x7)
包装: 带卷 (TR)
输入数目和类型: 4 个单端,双极;2 个差分,双极
MAX1183
Dual 10-Bit, 40Msps, 3V, Low-Power ADC with
Internal Reference and Parallel Outputs
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = 3V, OVDD = 2.5V, 0.1F and 1.0F capacitors from REFP, REFN, and COM to GND, REFOUT connected to REFIN through a
10k resistor, VIN = 2VP-P (differential with respect to COM), CL = 10pF at digital outputs (Note 1), fCLK = 40MHz, TA = TMIN to TMAX,
unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD, OVDD to GND .............................................. -0.3V to +3.6V
OGND to GND.......................................................-0.3V to +0.3V
INA+, INA-, INB+, INB- to GND ...............................-0.3V to VDD
REFIN, REFOUT, REFP, REFN,
COM, CLK to GND .................................-0.3V to (VDD + 0.3V)
OE, PD, SLEEP, T/B
D9A–D0A, D9B–D0B to OGND ...........-0.3V to (OVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
48-Pin TQFP-EP
(derate 30.4mW/°C above +70°C) ..........................2430mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
Resolution
10
Bits
Integral Nonlinearity
INL
fIN = 7.51MHz
±0.5
±1.7
LSB
Differential Nonlinearity
DNL
fIN = 7.51MHz, no missing codes guaranteed
±0.25
±1.0
LSB
Offset Error
<±1
±1.8
% FS
Gain Error
0±2
% FS
ANALOG INPUT
Differential Input Voltage Range
VDIFF
Differential or single-ended inputs
±1.0
V
Common-Mode Input Voltage
Range
VCM
VDD/2
±0.5
V
Input Resistance
RIN
Switched capacitor load
50
k
Input Capacitance
CIN
5pF
CONVERSION RATE
Maximum Clock Frequency
fCLK
40
MHz
Data Latency
5
Clock
Cycles
DYNAMIC CHARACTERISTICS
fINA or B = 7.51MHz, TA = +25°C
57.3
59.6
Signal-to-Noise Ratio
(Note 3)
SNR
fINA or B = 20MHz, TA = +25°C
56.8
59.6
dB
fINA or B = 7.51MHz, TA = +25°C
57
59.4
Signal-to-Noise and Distortion
(Note 3)
SINAD
fINA or B = 20MHz, TA = +25°C
56.5
59
dB
fINA or B = 7.51MHz, TA = +25°C
65
76
Spurious-Free Dynamic Range
(Note 3)
SFDR
fINA or B = 20MHz, TA = +25°C
65
73
dBc
fINA or B = 7.51MHz, TA = +25°C
-73
-64
Total Harmonic Distortion
(First 4 harmonics) (Note 3)
THD
fINA or B = 20MHz, TA = +25°C
-73
-63
dBc
fINA or B = 7.51MHz
-76
Third-Harmonic Distortion
(Note 3)
HD3
fINA or B = 20MHz
-73
dB
Intermodulation Distortion
IMD
fINA or B = 11.6066MHz at -6.5dBFS,
fINA or B = 13.3839MHz at -6.5dBFS
(Note 4)
-78
dBc
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