参数资料
型号: MAX1383ATP+T
厂商: Maxim Integrated Products
文件页数: 12/25页
文件大小: 0K
描述: IC ADC 12BIT 1.25MSPS 20-TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
位数: 12
采样率(每秒): 1.25M
数据接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
转换器数目: 2
功率耗散(最大): 85.5mW
电压电源: 单电源
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 20-WQFN 裸露焊盘
供应商设备封装: 20-TQFN-EP(5x5)
包装: 带卷 (TR)
输入数目和类型: 2 个单端,单极;2 个单端,双极;1 个差分,单极;1 个差分,双极
MAX1377/MAX1379/MAX1383
Dual, 12-Bit, 1.25Msps Simultaneous-Sampling
ADCs with Serial Interface
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND ........................................................-0.3V to +6V
VL to DGND ..............................................................-0.3V to +6V
SCLK, CS, CNVST, U/B, S/D, SEL,
REFSEL to DGND.......................................-0.3V to (VL + 0.3V)
DOUT_ to DGND ...........................................-0.3V to (VL + 0.3V)
AIN1A, AIN1B, AIN2A, AIN2B to AGND
MAX1377/MAX1379 .............................-0.3V to (AVDD + 0.3V)
MAX1383 ..............................................................-12V to +12V
RGND to AGND.....................................................-0.3V to +0.3V
RGND to DGND.....................................................-0.3V to +0.3V
DGND to AGND.....................................................-0.3V to +0.3V
Maximum Current into Any Pin (except power-supply pins).....50mA
Continuous Power Dissipation (TA = +70°C)
20-Pin Thin QFN (derate 34.5mW/°C above +70°C) ...2758.6mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
ELECTRICAL CHARACTERISTICS—MAX1377
(VAVDD = 2.7V to 3.6V, VL = 1.8V to AVDD, fSCLK = 20MHz (50% duty cycle), VREF = 2.048V, REFSEL = VL, S/D = DGND, CREF =
1F; TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
Resolution
12
Bits
Relative Accuracy
INL
(Note 1)
-1.25
+1.25
LSB
Differential Nonlinearity
DNL
-1
+1.5
LSB
Offset Error
±8
LSB
Offset-Error Matching
±12
LSB
Gain Error
(Note 2)
±6
LSB
Gain-Error Matching
(Note 2)
±6
LSB
Gain Temperature Coefficient
±2
ppm/
oC
AIN1A to AIN1B, AIN2A to AIN2B
80
DC Input Isolation
AIN1A to AIN2A, AIN1B to AIN2B
80
dB
DYNAMIC SPECIFICATIONS (fIN = 500kHz, 2VP-P sine wave, 1.25Msps, 20MHz fSCLK)
Unipolar
66
69.5
Signal-to-Noise Plus Distortion
SINAD
Bipolar
67
70
dB
Unipolar
66
70
Signal-to-Noise Ratio
SNR
Bipolar
67
70
dB
Total Harmonic Distortion
THD
Up to the 5th harmonic
-84
-74
dB
Spurious-Free Dynamic Range
SFDR
-86
-76
dB
Intermodulation Distortion
IMD
fIN1 = 103.5kHz, fIN2 = 113.5kHz
-78
dB
Full-Power Bandwidth
-3dB point
5
MHz
Full-Linear Bandwidth
(S/N + D) > 68dB, 1V input
1
MHz
CONVERSION RATE (Figure 4)
Minimum Conversion Time
tCONV
16 clock cycles per conversion (Note 3)
0.800
s
Dual output mode, S/D = 0
1.25
Maximum Throughput Rate
Single output mode, S/D = 1
0.625
Msps
Minimum Throughput Rate for
Full Bandwidth Signal
(Note 4)
10
ksps
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