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| 型号： | MAX15002ATL+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/29页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM 40-TQFNEP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| PWM 型： | 电压模式 |
| 输出数： | 2 |
| 频率 - 最大： | 2.2MHz |
| 电源电压： | 5.5 V ~ 23 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 40-WFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
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MAX15002
Dual-Output Buck Controller with
Tracking/Sequencing
ABSOLUTE MAXIMUM RATINGS
IN, LX_, CSN_ to SGND..........................................-0.3V to +30V
BST_ to SGND ........................................................-0.3V to +30V
BST_ to LX_ ..............................................................-0.3V to +6V
REG, DREG_, SYNC, EN_, RT, CT,
RESET , PHASE, SEL to SGND ...............................-0.3V to +6V
ILIM_, PGOOD_, FB_, COMP_, CSP_ to SGND .......-0.3V to +6V
DL_ to PGND_.......................................-0.3V to (V DREG_ + 0.3V)
DH_ to LX_ ...............................................-0.3V to (V BST_ + 0.3V)
PGND_ to SGND, PGND_ to Any Other PGND_.......-0.3V to +0.3V
Continuous Power Dissipation (T A = +70°C)
40-Pin TQFN (derate 37mW/°C above +70°C) .............2963mW*
Operating Junction Temperature Range ...........-40 o C to +125°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
*As per JEDEC51 standard (multilayer board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
40 TQFN-EP
Junction-to-Ambient Thermal Resistance ( θ JA )...............27°C/W
Junction-to-Case Thermal Resistance ( θ JC )......................1°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .
ELECTRICAL CHARACTERISTICS
(V IN = 5.5V to 23V or V IN = V REG = 4.5V to 5.5V, V DREG_ = V REG , V PGND_ = V SYNC = V PHASE = V SEL = 0V, C REG = 2.2μF, R RT = 100k ? ,
C CT = 0.1μF, R ILIM_ = 60k ? , T A = T J = -40°C to +125°C, unless otherwise noted. Typical values are at V IN = 12V, T A = T J = +25°C.)
(Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SYSTEM SPECIFICATIONS
Input-Voltage Range
V IN
V IN = V REG = V DREG_ (Note 3)
5.5
4.5
23.0
5.5
V
V
Input Undervoltage Lockout
Threshold
V UVLO
V IN rising
3.95
4.05
4.15
V
Input Undervoltage Lockout
Hysteresis
0.35
V
Operating Supply Current
Shutdown Supply Current
V IN = 12V, V FB_ = 0.8V
V IN = 12V, V EN_ = 0V, PGOOD_ unconnected
4.3
150
6.0
300
mA
μA
REG VOLTAGE REGULATOR
Output-Voltage Setpoint
Load Regulation
V REG
V IN = 5.5V to 23V
I REG = 0 to 120mA, V IN = 12V
4.9
5.2
0.2
V
V
DIGITAL SOFT-START/SOFT-STOP
Soft-Start/Soft-Stop Duration
Reference Voltage Steps
ERROR TRANSCONDUCTANCE AMPLIFIER
2048
64
Clocks
Steps
FB_, TRACK_ Input Bias Current
-250
+250
nA
FB_ Voltage Setpoint
V FB
T A = T J = 0°C to +85°C
T A = T J = -40°C to +125°C
0.593
0.590
0.600
0.600
0.605
0.608
V
V
FB_ to COMP_
Transconductance
2.1
mS
COMP_ Output Swing
0.75
3.50
V
2
Maxim Integrated
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