参数资料
型号: MAX17480EVKIT+
厂商: Maxim Integrated Products
文件页数: 37/48页
文件大小: 0K
描述: EVALUATION KIT FOR MAX17480
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1
主要目的: DC/DC,步降
输出及类型: 3,非隔离
输入电压: 4 ~ 26 V
稳压器拓扑结构: 降压
板类型: 完全填充
已供物品:
已用 IC / 零件: MAX17480
AMD 2-/3-Output Mobile Serial
VID Controller
Adaptive dead-time circuits monitor the DL and DH dri-
vers and prevent either FET from turning on until the
other is fully off. The adaptive driver dead time allows
operation without shoot-through with a wide range of
MOSFETs, minimizing delays and maintaining efficiency.
There must be a low-resistance, low-inductance path
from the DL and DH drivers to the MOSFET gates
for the adaptive dead-time circuits to work properly;
otherwise, the sense circuitry in the MAX17480 inter-
prets the MOSFET gates as “off” while charge actually
remains. Use very short, wide traces (50 mils to 100
mils wide if the MOSFET is 1in from the driver).
enabled, setting the PSI_L bit to 0 disables the offset,
reducing power consumption in the low-power state.
See the Core SMPS Offset section for a detailed
description of this feature.
In addition, the address of the core SMPSs can be
exchanged, allowing for flexible layout of the MAX17480
with respect to the CPU placement on the same or
opposite sides of the PCB. Table 5 shows the OPTION
pin voltage levels and the features that are enabled.
The internal pulldown transistor that drives DL low is
robust, with a 0.25 ? (typ) on-resistance. This helps pre-
vent DL from being pulled up due to capacitive coupling
from the drain to the gate of the low-side MOSFETs
when the inductor node (LX) quickly switches from
ground to V IN . Applications with high input voltages and
long inductive driver traces could require rising LX
MAX17480
BST
DH
LX
(R BST )*
C BST
N H
INPUT (V IN )
L
edges that do not pull up the low-side MOSFET’s gate,
causing shoot-through currents. The capacitive coupling
between LX and DL created by the MOSFET’s gate-to-
drain capacitance (C RSS ), gate-to-source capacitance
(C ISS - C RSS ), and additional board parasitics should not
exceed the following minimum threshold:
V DD
C BYP
V GS ( TH ) > V IN ? RSS ?
? C ?
? C ISS ?
Typically, adding a 4700pF capacitor between DL and
DL
PGND
(C NL )*
N L
power ground (C NL in Figure 11), close to the low-side
MOSFETs, greatly reduces coupling. Do not exceed
22nF of total gate capacitance to prevent excessive
turn-off delays.
Alternatively, shoot-through currents can be caused by
a combination of fast high-side MOSFETs and slow low-
side MOSFETs. If the turn-off delay time of the low-side
MOSFET is too long, the high-side MOSFETs can turn
on before the low-side MOSFETs have actually turned
off. Adding a resistor less than 5 ? in series with BST
slows down the high-side MOSFET turn-on time, elimi-
nating the shoot-through currents without degrading the
(R BST )* OPTIONAL—THE RESISTOR LOWERS EMI BY DECREASING
THE SWITCHING NODE RISE TIME.
(C NL )* OPTIONAL—THE CAPACITOR REDUCES LX-TO-DL CAPACITIVE
COUPLING THAT CAN CAUSE SHOOT-THROUGH CURRENTS.
Figure 11. Gate-Drive Circuit
Table 5. OPTION Pin Settings
turn-off time (R BST in Figure 11). Slowing down the
high-side MOSFET also reduces the LX node rise time,
thereby reducing EMI and high-frequency coupling
responsible for switching noise.
Offset and Address Change
for Core SMPSs (OPTION)
The +12.5mV offset and the address change features
OPTION
V CC
3.3V
2V
GND
OFFSET
ENABLES
0
0
1
1
SMPS1
ADDRESS
BIT 1 (VDD0)
BIT 2 (VDD1)
BIT 1 (VDD0)
BIT 2 (VDD1)
SMPS2
ADDRESS
BIT 2 (VDD1)
BIT 1 (VDD0)
BIT 2 (VDD1)
BIT 1 (VDD0)
of the MAX17480 can be selectively enabled and dis-
abled by the OPTION pin setting. When the offset is
Note: VDD0 refers to CORE0 and VDD1 refers to CORE1 for
the AMD CPU.
______________________________________________________________________________________
37
相关PDF资料
PDF描述
LM4040A25IDCKRE4 IC VREF SHUNT PREC 2.5V SC-70-5
ECM25DCTN-S288 CONN EDGECARD 50POS .156 EXTEND
RCC05DRTI-S13 CONN EDGECARD 10POS .100 EXTEND
GBC31DCMH-S288 CONN EDGECARD 62POS .100 EXTEND
RBC07DREN-S13 CONN EDGECARD 14POS .100 EXTEND
相关代理商/技术参数
参数描述
MAX17480EVKIT+ 功能描述:电源管理IC开发工具 MAX17480 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V
MAX17480GTL+ 功能描述:显示驱动器和控制器 2-/3-Output Mobile erial VID Ctlr RoHS:否 制造商:Panasonic Electronic Components 工作电源电压:2.7 V to 5.5 V 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Reel
MAX17480GTL+T 功能描述:显示驱动器和控制器 2-/3-Output Mobile erial VID Ctlr RoHS:否 制造商:Panasonic Electronic Components 工作电源电压:2.7 V to 5.5 V 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Reel
MAX17482GTL+ 功能描述:电压模式 PWM 控制器 NDA IC RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel
MAX17482GTL+T 功能描述:电压模式 PWM 控制器 NDA IC RoHS:否 制造商:Texas Instruments 输出端数量:1 拓扑结构:Buck 输出电压:34 V 输出电流: 开关频率: 工作电源电压:4.5 V to 5.5 V 电源电流:600 uA 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装 / 箱体:WSON-8 封装:Reel