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参数资料
| 型号： | MAX1889ETE+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 24/32页 |
| 文件大小： | 0K |
| 描述： | IC PWR SUP TRPL LCD 16-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 应用： | 控制器，TFT LCD |
| 输入电压： | 2.7 V ~ 5.5 V |
| 输出数： | 3 |
| 输出电压： | 2.7 V ~ 13 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-WQFN 裸露焊盘 |
| 供应商设备封装： | 16-TQFN-EP（5x5） |
| 包装： | 带卷 (TR) |
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Triple-Output TFT LCD Power Supply
with Fault Protection
Applications Information
PC Board Layout
Careful PC board layout is extremely important for
proper operation. Use the following guidelines for good
PC board layout:
1) Minimize the area of high-current loops by placing
the input capacitors, inductor, output diode, and
output capacitors less than 0.2in (5mm) from the LX
and PGND pins. Connect these components with
traces as wide as possible. Avoid using vias in the
high-current paths. If vias are unavoidable, use
many vias in parallel to reduce resistance and
inductance.
2) Create islands for the analog ground (GND), power
ground (PGND), and linear regulator ground. Star-
connect them to the backside pad of the device.
The REF bypass capacitor and both feedback
dividers should be connected to the analog ground
island (GND). The step-up regulator ’ s input and out-
put capacitors, and the charge-pump components
should be a wide power ground plane. The power
ground plane should be connected to the power
ground pin (PGND) with a wide trace. Maximizing
the width of the power ground traces improves effi-
ciency and reduces output voltage ripple and noise
R8
3k ?
V N
spikes. All the other ground connections, such as
the IN pin bypass capacitor and the linear regulator
output capacitors, should be star-connected to the
backside of the device with wide traces. Make no
other connections between these separate ground
planes.
3) Place IN pin and REF pin bypass capacitors as
close to the device as possible.
4) Place all feedback voltage-divider resistors as close
to their respective feedback pins as possible. The
divider ’ s center trace should be kept short. Placing
the resistors far away causes their FB traces to
become antennas that can pick up switching noise.
Care should be taken to avoid running any feedback
trace near LX or the switching nodes in the charge
pumps.
5) Minimize the length and maximize the width of the
traces between the output capacitors and the load
for best transient responses.
6) Minimize the size of LX node while keeping it wide
and short. Keep the LX node away from feedback
nodes (FB, FBP, and FBN) and analog ground. Use
DC traces as shield if necessary.
Refer to the MAX1889 evaluation kit for an example of
proper board layout.
R11
3k ?
V P
MAX1889
V NL
Q1
R9
150k ?
1%
7
6
DRVN
FBN
DRVP
FBP
8
9
R12
301k ?
1%
Q2
V PL
C19
1000pF
R10
24.3k ?
R13
20k ?
1%
C21
1000pF
1%
REF
Figure 8. LDO Compensation
24
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX1889EVKIT | 功能描述:电源管理IC开发工具 MAX1889 Eval Kit RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| MAX188ACAP | 功能描述:模数转换器 - ADC Integrated Circuits (ICs) RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX188ACAP+ | 功能描述:模数转换器 - ADC 12-Bit 8Ch 133ksps 5.25V Precision ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX188ACAP+T | 功能描述:模数转换器 - ADC 12-Bit 8Ch 133ksps 5.25V Precision ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| MAX188ACAP-T | 功能描述:模数转换器 - ADC RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
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