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| 型号： | MAX8707ETL+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 35/37页 |
| 文件大小： | 0K |
| 描述： | IC CNTRLR MULTIPHASE 40TQFN |
| 标准包装： | 2,500 |
| 应用： | 控制器，AMD Hammer CPU 电源 |
| 输入电压： | 4.5 ~ 5.5 V |
| 输出数： | 4 |
| 输出电压： | 0.8 ~ 1.55 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 40-WFQFN 裸露焊盘 |
| 供应商设备封装： | 40-TQFN-EP（6x6） |
| 包装： | 带卷 (TR) |
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Multiphase, Fixed-Frequency Controller for
AMD Hammer CPU Core Power Supplies
This is essential for high-power MOSFETs that
require low-impedance gate drivers to avoid shoot-
through currents.
7) When trade-offs in trace lengths must be made, it ’ s
preferable to allow the inductor charging path to be
made longer than the discharge path. For example,
it ’ s better to allow some extra distance between the
input capacitors and the high-side MOSFET than to
allow distance between the inductor and the low-
side MOSFET or between the inductor and the out-
put filter capacitor.
Layout Procedure
1) Place the power components first, with ground termi-
nals adjacent (low-side MOSFET source, C IN , C OUT ,
and D1 anode). If possible, make all these connec-
tions on the top layer with wide, copper-filled areas.
2) Mount the driver IC adjacent to the low-side
MOSFETs. The DL gate traces must be short and
wide (50mils to 100mils wide if the MOSFET is 1in
from the driver IC).
3) Group the gate-drive components (BST diodes and
capacitors, V DD bypass capacitor) together near the
driver IC.
4) Make the DC-DC controller ground connections as
shown in the Standard Application Circuits . This dia-
gram can be viewed as having three separate
ground planes: input/output ground, where all the
high-power components go; the power ground
plane, where the PGND pin, V DD bypass capacitor,
and driver IC ground connection go; and the con-
troller ’ s analog ground plane, where sensitive ana-
log components, the master ’ s GND pin, and the V CC
bypass capacitor go. The controller ’ s analog ground
plane (GND) must meet the power ground plane
(PGND) only at a single point directly beneath the
IC. The power ground plane should connect to the
high-power output ground with a short, thick metal
trace from PGND to the source of the low-side
MOSFETs (the middle of the star ground).
5) Connect the output power planes (V CORE and sys-
tem ground planes) directly to the output-filter-
capacitor positive and negative terminals with
multiple vias. Place the entire DC-DC converter cir-
cuit as close to the CPU as is practical.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX8708ETJ | 制造商:Maxim Integrated Products 功能描述:AMD CPU CORE SUPPLY - Rail/Tube |
| MAX8708ETJ-T | 制造商:Maxim Integrated Products 功能描述:AMD CPU CORE SUPPLY - Tape and Reel |
| MAX8709AETI | 功能描述:显示驱动器和控制器 RoHS:否 制造商:Panasonic Electronic Components 工作电源电压:2.7 V to 5.5 V 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Reel |
| MAX8709AETI+ | 功能描述:显示驱动器和控制器 CCFL Backlight Controller w/SMBus RoHS:否 制造商:Panasonic Electronic Components 工作电源电压:2.7 V to 5.5 V 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Reel |
| MAX8709AETI+T | 功能描述:显示驱动器和控制器 CCFL Backlight Controller w/SMBus RoHS:否 制造商:Panasonic Electronic Components 工作电源电压:2.7 V to 5.5 V 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Reel |
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