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| 型号： | MAX8760ETL+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 37/39页 |
| 文件大小： | 0K |
| 描述： | IC CNTRLR QUICK PWM 40-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 50 |
| 系列： | Quick-PWM™ |
| 应用： | 控制器，6 位 VID AMD 移动式 Turion? |
| 输入电压： | 4 V ~ 28 V |
| 输出数： | 2 |
| 输出电压： | 0.38 V ~ 1.55 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 40-WFQFN 裸露焊盘 |
| 供应商设备封装： | 40-TQFN-EP（6x6） |
| 包装： | 管件 |
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Dual-Phase, Quick-PWM Controller for AMD
Mobile Turion 64 CPU Core Power Supplies
Applications Information
PC Board Layout Guidelines
Careful PC board layout is critical to achieve low
switching losses and clean, stable operation. The
switching power stage requires particular attention
(Figure 11). If possible, mount all the power compo-
nents on the top side of the board with their ground ter-
8)
inductor and the low-side MOSFET or between the
inductor and the output filter capacitor.
Route high-speed switching nodes away from
sensitive analog areas (REF, CCV, CCI, FB, C_P,
C_N, etc). Make all pin-strap control input connec-
tions ( SHDN , ILIM, SKIP , SUS, S_, TON) to analog
ground or V CC rather than power ground or V DD .
minals flush against one another. Follow these
guidelines for good PC board layout:
Layout Procedure
Place the power components first, with ground termi-
1)
2)
Keep the high-current paths short, especially at
the ground terminals. This is essential for stable,
jitter-free operation.
Connect all analog grounds to a separate solid
copper plane, which connects to the GND pin of
the Quick-PWM controller. This includes the V CC
bypass capacitor, REF and GNDS bypass capaci-
nals adjacent (low-side MOSFET source, C IN , C OUT ,
and D1 anode). If possible, make all these connections
on the top layer with wide, copper-filled areas.
1) Mount the controller IC adjacent to the low-side
MOSFET. The DL gate traces must be short and
wide (50 mils to 100 mils wide if the MOSFET is
1in from the controller IC).
tors, compensation (CC_) components, and the
resistive dividers connected to ILIM and OFS.
2)
Group the gate-drive components (BST diodes
and capacitors, V DD bypass capacitor) together
3)
Each slave controller should also have a separate
near the controller IC.
analog ground. Return the appropriate noise-sen-
sitive slave components to this plane. Since the
reference in the master is sometimes connected
to the slave, it may be necessary to couple the
analog ground in the master to the analog ground
in the slave to prevent ground offsets. A low-value
( ≤ 10 ? ) resistor is sufficient to link the two grounds.
3)
Make the DC-to-DC controller ground connections
as shown in the Standard Application Circuits .
This diagram can be viewed as having four sepa-
rate ground planes: input/output ground, where all
the high-power components go; the power ground
plane, where the PGND pin and V DD bypass
capacitor go; the master’s analog ground plane,
4)
5)
Keep the power traces and load connections short.
This is essential for high efficiency. The use of thick
copper PC boards (2oz vs. 1oz) can enhance
full-load efficiency by 1% or more. Correctly routing
PC board traces is a difficult task that must be ap-
proached in terms of fractions of centimeters, where
a single m ? of excess trace resistance causes a
measurable efficiency penalty.
Keep the high-current, gate-driver traces (DL, DH,
LX, and BST) short and wide to minimize trace
resistance and inductance. This is essential for
high-power MOSFETs that require low-impedance
gate drivers to avoid shoot-through currents.
where sensitive analog components, the master’s
GND pin, and V CC bypass capacitor go; and the
slave’s analog ground plane, where the slave’s
GND pin and V CC bypass capacitor go. The mas-
ter’s GND plane must meet the PGND plane only
at a single point directly beneath the IC. Similarly,
the slave’s GND plane must meet the PGND plane
only at a single point directly beneath the IC. The
respective master and slave ground planes
should connect to the high-power output ground
with a short metal trace from PGND to the source
of the low-side MOSFET (the middle of the star
ground). This point must also be very close to the
output capacitor ground terminal.
6)
7)
C_P, C_N, OAIN+, and OAIN- connections for cur-
rent limiting and voltage positioning must be made
using Kelvin-sense connections to guarantee the
current-sense accuracy.
When trade-offs in trace lengths must be made, it
4)
Connect the output power planes (V CORE and
system ground planes) directly to the output filter
capacitor positive and negative terminals with
multiple vias. Place the entire DC-to-DC converter
circuit as close to the CPU as is practical.
is preferable to allow the inductor-charging path to
be made longer than the discharge path. For
example, it is better to allow some extra distance
between the input capacitors and the high-side
MOSFET than to allow distance between the
Chip Information
TRANSISTOR COUNT: 11,015
PROCESS: BiCMOS
______________________________________________________________________________________
37
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX8760ETL+ | 功能描述:电流型 PWM 控制器 Dual-Phase Quick PWM Controller RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| MAX8760ETL+T | 功能描述:电流型 PWM 控制器 Dual-Phase Quick PWM Controller RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| MAX8760ETL-T | 功能描述:电流型 PWM 控制器 RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| MAX8760EVKIT | 功能描述:电流型 PWM 控制器 Evaluation Kit for the MAX8760 RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| MAX8761ETG+ | 功能描述:LCD 驱动器 Linear-Regulator LCD Panel Power Supply RoHS:否 制造商:Maxim Integrated 数位数量:4.5 片段数量:30 最大时钟频率:19 KHz 工作电源电压:3 V to 3.6 V 最大工作温度:+ 85 C 最小工作温度:- 20 C 封装 / 箱体:PDIP-40 封装:Tube |
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