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| 型号： | MAX9888EVKIT+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 112/115页 |
| 文件大小： | 0K |
| 描述： | KIT EVALUATION FOR MAX9888 |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 系列： | DirectDrive®, FLEXSOUND™ |
| 相关产品： | MAX9888EWY+T-ND - IC CODEC AUDIO FLEXSOUND 63WLP |
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Stereo Audio CODEC
with FlexSound Technology
MAX9888
96
Alternative approaches to eliminating the output-cou-
pling capacitors involve biasing the headphone return
(sleeve) to the DC bias voltage of the headphone ampli-
fiers. This method raises some issues:
U
The sleeve is typically grounded to the chassis. Using
the midrail biasing approach, the sleeve must be
isolated from system ground, complicating product
design.
U
During an ESD strike, the amplifier’s ESD structures
are the only path to system ground. Thus, the ampli-
fier must be able to withstand the full energy from an
ESD strike.
U
When using the headphone jack as a line out to other
equipment, the bias voltage on the sleeve may con-
flict with the ground potential from other equipment,
resulting in possible damage to the amplifiers.
The IC features a low-noise charge pump to generate
a negative supply for the headphone amplifier. The
nominal switching frequency is well beyond the audio
range, and thus does not interfere with audio signals.
The switch drivers feature a controlled switching speed
that minimizes noise generated by turn-on and turn-off
transients. By limiting the switching speed of the charge
pump, the di/dt noise caused by the parasitic trace
inductance is minimized. The charge pump is active only
in headphone modes.
To reduce audible noise at the outputs, the IC’s head-
phone amplifier includes headphone ground sensing.
Connect the sense line (HPSNS) to the ground terminal
of the device’s headphone jack. Any noise present at
the headphone ground is then added to the headphone
output. The result is elimination of this noise from the
audible output. If ground sensing is not required, con-
nect HPSNS directly to ground. Figure 30 shows a block
diagram of the headphone output section including the
headphone sense function.
Headphone Output Mixers
The IC’s headphone amplifier accepts input from the
stereo DAC and the line inputs. The output of the left and
right DAC cannot be mixed at the headphone mixer. Use
MIXDAL/MIXDAR to mix the left and right audio channels
before conversion.
Figure 29. Traditional Amplifier Output vs. DirectDrive Output
Figure 30. Headphone Amplifier Block Diagram
VDD
VDD/2
GND
CONVENTIONAL AMPLIFIER BIASING SCHEME
DirectDrive AMPLIFIER BIASING SCHEME
+VDD
GND
-VDD
(VSS)
MIXHPL
MIXHPR
MIX
PGAOUT2:
0dB TO -23dB
HPVOLL:
+3dB TO -67dB
HPVOLR:
+3dB TO -67dB
PREOUT2
+9dB
PGAOUT1:
0dB TO -23dB
DAREN
HPL
HPSNS
HPLEN
HPREN
HPR
PREOUT1
+9dB
DACR
DALEN
DACL
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX9888EVKIT+ | 功能描述:音频 IC 开发工具 MAX9888 Eval Kit RoHS:否 制造商:Texas Instruments 产品:Evaluation Kits 类型:Audio Amplifiers 工具用于评估:TAS5614L 工作电源电压:12 V to 38 V |
| MAX9888EWY+T | 功能描述:接口—CODEC Stereo Audio CODEC RoHS:否 制造商:Texas Instruments 类型: 分辨率: 转换速率:48 kSPs 接口类型:I2C ADC 数量:2 DAC 数量:4 工作电源电压:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-81 封装:Reel |
| MAX9889EWO+T | 功能描述:接口—CODEC RoHS:否 制造商:Texas Instruments 类型: 分辨率: 转换速率:48 kSPs 接口类型:I2C ADC 数量:2 DAC 数量:4 工作电源电压:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-81 封装:Reel |
| MAX988ESA | 功能描述:校验器 IC Single uPower Comparator RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压（最大值）:6 mV 电源电流（最大值）:1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel |
| MAX988ESA+ | 功能描述:校验器 IC Single uPower Comparator RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压（最大值）:6 mV 电源电流（最大值）:1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel |
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