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| 型号： | MAX9888EVKIT+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 16/115页 |
| 文件大小： | 0K |
| 描述： | KIT EVALUATION FOR MAX9888 |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 系列： | DirectDrive®, FLEXSOUND™ |
| 相关产品： | MAX9888EWY+T-ND - IC CODEC AUDIO FLEXSOUND 63WLP |
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Stereo Audio CODEC
with FlexSound Technology
MAX9888
112
Recommended PCB Routing
The IC uses a 63-bump WLP package. Figure 42
provides an example of how to connect to all active
bumps using 3 layers of the PCB. To ensure uninter-
rupted ground returns, use layer 2 as a connecting layer
between layer 1 and layer 2 and flood the remaining area
with ground.
Supply Bypassing, Layout, and Grounding
Proper layout and grounding are essential for optimum
performance. When designing a PCB for the IC, parti-
tion the circuitry so that the analog sections of the IC are
separated from the digital sections. This ensures that the
analog audio traces are not routed near digital traces.
Use a large continuous ground plane on a dedicated
layer of the PCB to minimize loop areas. Connect AGND,
DGND, HPGND, SPKLGND, and SPKRGND directly to
the ground plane using the shortest trace length pos-
sible. Proper grounding improves audio performance,
minimizes crosstalk between channels, and prevents
any digital noise from coupling into the analog audio
signals.
Ground the bypass capacitors on MICBIAS, REG, PREG,
and REF directly to the ground plane with minimum
trace length. Also be sure to minimize the path length to
AGND. Bypass AVDD directly to AGND.
Connect all digital I/O termination to the ground plane
with minimum path length to DGND. Bypass DVDD,
DVDDS1, and DVDDS2 directly to DGND.
Place the capacitor between C1P and C1N as close as
possible to the IC to minimize trace length from C1P to
C1N. Inductance and resistance added between C1P
and C1N reduce the output power of the headphone
amplifier. Bypass HPVSS with a capacitor located close
to HPVSS with a short trace length to HPGND. Close
decoupling of HPVSS minimizes supply ripple and maxi-
mizes output power from the headphone amplifier.
HPSNS senses ground noise on the headphone jack and
adds the same noise to the output audio signal, thereby
making the output (headphone output minus ground)
noise free. Connect HPSNS to the headphone jack shield
to ensure accurate pickup of headphone ground noise.
Bypass SPKLVDD and SPKRVDD to SPKLGND and
SPKRGND, respectively, with as little trace length as
possible. Connect SPKLP, SPKLN, SPKRP, and SPKRN
to the stereo speakers using the shortest traces pos-
sible. Reducing trace length minimizes radiated EMI.
Route SPKLP/SPKLN and SPKRP/SPKRN as differential
pairs on the PCB to minimize loop area, thereby the
inductance of the circuit. If filter components are used
on the speaker outputs, be sure to locate them as close
as possible to the IC to ensure maximum effectiveness.
Minimize the trace length from any ground-connected
passive components to SPKLGND and SPKRGND to
further minimize radiated EMI.
Figure 42. Suggested Routing
LAYER 1
LAYER 2
LAYER 3
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX9888EVKIT+ | 功能描述:音频 IC 开发工具 MAX9888 Eval Kit RoHS:否 制造商:Texas Instruments 产品:Evaluation Kits 类型:Audio Amplifiers 工具用于评估:TAS5614L 工作电源电压:12 V to 38 V |
| MAX9888EWY+T | 功能描述:接口—CODEC Stereo Audio CODEC RoHS:否 制造商:Texas Instruments 类型: 分辨率: 转换速率:48 kSPs 接口类型:I2C ADC 数量:2 DAC 数量:4 工作电源电压:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-81 封装:Reel |
| MAX9889EWO+T | 功能描述:接口—CODEC RoHS:否 制造商:Texas Instruments 类型: 分辨率: 转换速率:48 kSPs 接口类型:I2C ADC 数量:2 DAC 数量:4 工作电源电压:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-81 封装:Reel |
| MAX988ESA | 功能描述:校验器 IC Single uPower Comparator RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压（最大值）:6 mV 电源电流（最大值）:1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel |
| MAX988ESA+ | 功能描述:校验器 IC Single uPower Comparator RoHS:否 制造商:STMicroelectronics 产品: 比较器类型: 通道数量: 输出类型:Push-Pull 电源电压-最大:5.5 V 电源电压-最小:1.1 V 补偿电压（最大值）:6 mV 电源电流（最大值）:1350 nA 响应时间: 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:SC-70-5 封装:Reel |
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