参数资料
型号: MC33989DW
厂商: Freescale Semiconductor
文件页数: 64/72页
文件大小: 0K
描述: IC SYSTEM BASE W/CAN 28-SOIC
标准包装: 26
控制器类型: 系统基础芯片
接口: CAN
电源电压: 5.5 V ~ 18 V
电流 - 电源: 45mA
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 28-SOIC(0.295",7.50mm 宽)
供应商设备封装: 28-SOIC W
包装: 管件
配用: KIT33989DWEVB-ND - KIT EVAL 33989DW HS SBC
Analog Integrated Circuit Device Data
Freescale Semiconductor
67
33989
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
INTRODUCTION
This thermal addendum is provided as a supplement to the MC33989 technical
datasheet. The addendum provides thermal performance information that may be
critical in the design and development of system applications. All electrical,
application, and packaging information is provided in the data sheet.
Packaging and Thermal Considerations
The MC33989 is offered in a 28 pin SOICW, single die package. There is a
single heat source (P), a single junction temperature (TJ), and thermal resistance
(RJA).
The stated values are solely for a thermal performance comparison of one
package to another in a standardized environment. This methodology is not
meant to and will not predict the performance of a package in an application-
specific environment. Stated values were obtained by measurement and
simulation according to the standards listed below.
Standards
Table 37. Thermal Performance Comparison
Thermal Resistance
[
C/W]
RJA
41
RJB
10
RJA
68
RJC
220
Notes:
1.
Per JEDEC JESD51-2 at natural convection, still air
condition.
2.
2s2p thermal test board per JEDEC JESD51-7.
3.
Per JEDEC JESD51-8, with the board temperature on the
center trace near the center lead.
4.
Single layer thermal test board per JEDEC JESD51-3.
5.
Thermal resistance between the die junction and the
package top surface; cold plate attached to the package top
surface and remaining surfaces insulated.
28-PIN
SOICW
33989SOIC
EG SUFFIX (PB-FREE)
98ASB42345B
28-PIN SOICW
Note For package dimensions, refer to
98ASB42345B.
TJ
=
RJA
.
P
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