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| 型号： | MC7448HX1000NC |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 46/60页 |
| 文件大小： | 0K |
| 描述： | IC MPU RISC 32BIT 360-FCCBGA |
| 标准包装： | 44 |
| 系列： | MPC74xx |
| 处理器类型： | 32-位 MPC74xx PowerPC |
| 速度： | 1.0GHz |
| 电压： | 1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 360-BCBGA，FCCBGA |
| 供应商设备封装： | 360-FCCBGA（25x25） |
| 包装： | 托盘 |
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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
50
Freescale Semiconductor
System Design Information
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Laird Technologies - Thermal
888-246-905
(formerly Thermagon Inc.)
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.lairdtech.com
The following section provides a heat sink selection example using one of the commercially available heat
sinks.
9.7.3
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ti + Tr + (RθJC + Rθint + Rθsa) × Pd
where:
Tj is the die-junction temperature
Ti is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
RθJC is the junction-to-case thermal resistance
Rθint is the adhesive or interface material thermal resistance
Rθsa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation, the die-junction temperatures (Tj) should be maintained less than the value specified in
Table 4. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (Ti)
may range from 30
to 40 C. The air temperature rise within a cabinet (Tr) may be in the range of 5 to
10 C. The thermal resistance of the thermal interface material (Rθint) is typically about 1.1 C/W. For
example, assuming a Ti of 30 C, a Tr of 5 C, an HCTE package RθJC = 0.1, and a power consumption
(Pd) of 25.6 W, the following expression for Tj is obtained:
Die-junction temperature:
Tj = 30 C + 5 C + (0.1 C/W + 1.1 C/W + θsa) × 25.6
For this example, a Rθsavalue of 1.53 C/W or less is required to maintain the die junction temperature
below the maximum value of Table 4.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
figure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat flow. The final die-junction
operating temperature is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component's power consumption, a
number of factors affect the final operating die-junction temperature—airflow, board population (local
heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, and so on.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MC7448HX1000ND | 功能描述:微处理器 - MPU APL8 RV2.2.1 1.0V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC7448HX1250N | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC7448 Hardware Specifications |
| MC7448HX1250NC | 功能描述:IC MPU RISC 32BIT 360-FCCBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA，FCBGA 供应商设备封装:783-FCPBGA（29x29） 包装:托盘 |
| MC7448HX1250ND | 功能描述:微处理器 - MPU APL8 RV2.2.1 1.1V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC7448HX1267NC | 功能描述:IC MPU RISC 32BIT 360-FCCBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA，FCBGA 供应商设备封装:783-FCPBGA（29x29） 包装:托盘 |
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