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| 型号： | MC7448HX1000NC |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 8/60页 |
| 文件大小： | 0K |
| 描述： | IC MPU RISC 32BIT 360-FCCBGA |
| 标准包装： | 44 |
| 系列： | MPC74xx |
| 处理器类型： | 32-位 MPC74xx PowerPC |
| 速度： | 1.0GHz |
| 电压： | 1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 360-BCBGA，FCCBGA |
| 供应商设备封装： | 360-FCCBGA（25x25） |
| 包装： | 托盘 |
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MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4
16
Freescale Semiconductor
Electrical and Thermal Characteristics
Notes:
1. Caution: The SYSCLK frequency and PLL_CFG[0:5] settings must be chosen such that the resulting SYSCLK (bus)
frequency, processor core frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum
operating frequencies. Refer to the PLL_CFG[0:5] signal description in Section 9.1.1, “PLL Configuration,” for valid
PLL_CFG[0:5] settings.
2. Actual maximum system bus frequency is system-dependent. See Section 5.2.1, “Clock AC Specifications.”
3. Rise and fall times for the SYSCLK input measured from 0.4 to 1.4 V
4. Timing is guaranteed by design and characterization.
5. Guaranteed by design
6. The SYSCLK driver’s closed loop jitter bandwidth should be less than 1.5 MHz at –3 dB.
7. Relock timing is guaranteed by design and characterization. PLL-relock time is the maximum amount of time required for PLL
lock after a stable VDD and SYSCLK are reached during the power-on reset sequence. This specification also applies when
the PLL has been disabled and subsequently re-enabled during sleep mode. Also note that HRESET must be held asserted
for a minimum of 255 bus clocks after the PLL-relock time during the power-on reset sequence.
8. This reflects the maximum and minimum core frequencies when the dynamic frequency switching feature (DFS) is disabled.
fcore_DFS provides the maximum and minimum core frequencies when operating in a DFS mode.
9.This specification supports the Dynamic Frequency Switching (DFS) feature and is applicable only when one of the DFS modes
(divide-by-2 or divide-by-4) is enabled. When DFS is disabled, the core frequency must conform to the maximum and minimum
frequencies stated for fcore.
10.Use of the DFS feature does not affect VCO frequency.
Table 8. Clock AC Timing Specifications
At recommended operating conditions. See Table 4.
Characteristic
Symbol
Maximum Processor Core Frequency (Speed Grade)
Unit
Notes
1000 MHz
1420 MHz
1600 MHz
1700 MHz
Min
Max
Min
Max
Min
Max
Min
Max
Processor
core
frequency
DFS mode disabled
fcore
600
1000
600
1420
600
1600
600
1700
MHz
1, 8
DFS mode enabled
fcore_DF
300
500
300
710
300
800
300
850
9
VCO frequency
fVCO
600
1000
600
1420
600
800
600
1700
MHz
1, 10
SYSCLK frequency
fSYSCLK
33
200
33
200
33
200
33
200
MHz
1, 2, 8
SYSCLK cycle time
tSYSCLK
5.0
30
5.0
30
5.0
30
5.0
30
ns
2
SYSCLK rise and fall time
tKR, tKF
—0.5
ns
3
SYSCLK duty cycle measured at
OVDD/2
tKHKL/
tSYSCLK
40
60
40
60
40
60
40
60
%
4
SYSCLK cycle-to-cycle jitter
—
150
—
150
—
150
—
150
ps
5, 6
Internal PLL relock time
—
100
—
100
—
100
—
100
μs7
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相关代理商/技术参数 |
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|---|---|
| MC7448HX1000ND | 功能描述:微处理器 - MPU APL8 RV2.2.1 1.0V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC7448HX1250N | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC7448 Hardware Specifications |
| MC7448HX1250NC | 功能描述:IC MPU RISC 32BIT 360-FCCBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA，FCBGA 供应商设备封装:783-FCPBGA（29x29） 包装:托盘 |
| MC7448HX1250ND | 功能描述:微处理器 - MPU APL8 RV2.2.1 1.1V 105C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC7448HX1267NC | 功能描述:IC MPU RISC 32BIT 360-FCCBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:MPC74xx 标准包装:1 系列:MPC85xx 处理器类型:32-位 MPC85xx PowerQUICC III 特点:- 速度:1.2GHz 电压:1.1V 安装类型:表面贴装 封装/外壳:783-BBGA，FCBGA 供应商设备封装:783-FCPBGA（29x29） 包装:托盘 |
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