参数资料
型号: MC8610PX1066JB
厂商: Freescale Semiconductor
文件页数: 92/96页
文件大小: 0K
描述: MPU E600 CORE 1066MHZ 783-PBGA
标准包装: 36
系列: MPC86xx
处理器类型: 32-位 MPC86xx PowerPC
速度: 1.066GHz
电压: 1V
安装类型: 表面贴装
封装/外壳: 783-BBGA,FCBGA
供应商设备封装: 783-FCPBGA(29x29)
包装: 托盘
MPC8610 Integrated Host Processor Hardware Specifications, Rev. 2
Package Information
Freescale Semiconductor
92
4.2
Part Marking
Parts are marked as the example shown in Figure 58.
Figure 58. Part Marking for FC-PBGA Device
5
Package Information
This section details package parameters and dimensions.
5.1
Package Parameters for the MPC8610
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm, 783 pins. There are two
package options: leaded flip chip-plastic ball grid array (FC-PBGA) and RoHS lead-free (FC-PBGA).
Die size
8.5 mm × 9.7 mm
Package outline
29 mm × 29 mm
Interconnects
783
Pitch
1 mm
Minimum module height
2.18 mm
Maximum module height
2.7 mm
Total capacitor count
23 caps; 100 nF each
For leaded FC-PBGA (package option: PX)
Solder balls
63% Sn 37% Pb
Ball diameter (typical)
0.50 mm
For RoHS lead-free FC-PBGA (package option: VT)
Solder balls
96.5% Sn, 3.5% Ag
Ball diameter (typical)
0.50 mm
MC8610
wxxyyyyMz
TWLYYWW
MMMM
YWWLAZ
YWWLAZ is the assembly traceability code.
MMMM is the M00 (mask) number.
TWLYYWW is the test code.
Note:
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