- 您现在的位置：买卖IC网 > PDF目录80461 > MC8610TPX1066JZ (FREESCALE SEMICONDUCTOR INC) MICROPROCESSOR, PBGA783 PDF资料下载
参数资料
| 型号： | MC8610TPX1066JZ |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | MICROPROCESSOR, PBGA783 |
| 封装： | 29 X 29 MM, PLASTIC, FCBGA-783 |
| 文件页数： | 84/96页 |
| 文件大小： | 1237K |
| 代理商： | MC8610TPX1066JZ |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页当前第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页
Hardware Design Considerations
MPC8610 Integrated Host Processor Hardware Specifications, Rev. 2
Freescale Semiconductor
85
To reduce the die-junction temperature, heat sinks are required; due to the potential large mass of the heat sink, attachment
through the printed-circuit board is suggested. In any implementation of a heat sink solution, the force on the die should not
exceed ten pounds force (45 newtons). Figure 54 shows a spring clip through the board. Occasionally the spring clip is attached
to soldered hooks or to a plastic backing structure. Screw and spring arrangements are also frequently used.
Figure 54. FC-PBGA Package Exploded Cross-Sectional View with Several Heat Sink Options
Suitable heat sinks are commercially available from the following vendors:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Advanced Thermal Solutions
781-769-2800
89 Access Road #27.
Norwood, MA02062
Internet: www.qats.com
Alpha Novatech
408-749-7601
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Calgreg Thermal Solutions
888-732-6100
60 Alhambra Road, Suite 1
Warwick, RI 02886
Internet: www.calgreg.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Thermal
Heat Sink
FC-PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material
相关PDF资料 |
PDF描述 |
|---|---|
| MB95F134NBWPFV | 8-BIT, FLASH, 16.25 MHz, MICROCONTROLLER, PDSO30 |
| MC9S12GC128PMPB25 | 16-BIT, FLASH, 25 MHz, MICROCONTROLLER, PQFP52 |
| M30201F6T-FP | 16-BIT, FLASH, 10 MHz, MICROCONTROLLER, PQFP56 |
| M48T37Y-70MH6F | 0 TIMER(S), REAL TIME CLOCK, PDSO44 |
| MC68HC08GP16ACFB | 8-BIT, MROM, 8.2 MHz, MICROCONTROLLER, PQFP44 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MC8610TPX1067G | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8610TPX1067J | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8610TPX800G | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Host Processor Hardware Specifications |
| MC8610TPX800GB | 功能描述:微处理器 - MPU REV 1.1 8610 1.0V -40C RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MC8610TPX800GZ | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MPC8610 Integrated Host Processor Hardware Specifications |
发布紧急采购，3分钟左右您将得到回复。