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| 型号： | MCF5233CVM150 |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 150 MHz, RISC PROCESSOR, PBGA256 |
| 封装： | MAPBGA-256 |
| 文件页数： | 47/76页 |
| 文件大小： | 2665K |
| 代理商： | MCF5233CVM150 |
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MOTOROLA
MCF523x Integrated Microprocessor Hardware Specifications
51
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Thermal Characteristics
3
θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Motorola
recommends the use of
θJmA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the
Ψjt
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
4
Per JEDEC JESD51-6 with the board horizontal.
5
θJMA and Ψjt parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Motorola
recommends the use of
θJmA and power dissipation specifications in the system design to prevent device junction
temperatures from exceeding the rated specification. System designers should be aware that device junction
temperatures can be significantly influenced by board layout and surrounding devices. Conformance to the device
junction temperature specification can be verified by physical measurement in the customer’s system using the
Ψjt
parameter, the device power dissipation, and the method described in EIA/JESD Standard 51-2.
6
Per JEDEC JESD51-6 with the board horizontal.
7
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
8
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
9
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
10 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
11 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
12 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
13 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
14 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
15 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
The average chip-junction temperature (TJ) in °C can be obtained from:
(1)
Where:
TA= Ambient Temperature, °C
Θ
JMA= Package Thermal Resistance, Junction-to-Ambient, °C/W
PD= PINT + PI/O
PINT= IDD × VDD, Watts - Chip Internal Power
PI/O= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
(2)
Solving equations 1 and 2 for K gives:
T
J
T
A
P
D
Θ
JMA
×
()
+
=
P
D
KT
J
273
°C
+
()
÷
=
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相关代理商/技术参数 |
参数描述 |
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| MCF5233CVM150J | 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF5234 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Microprocessor Hardware Specification |
| MCF5234256MAPBGA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Integrated Microprocessor Hardware Specification |
| MCF5234CVM100 | 功能描述:微处理器 - MPU MCF5234 V2CORE 64KSRAM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MCF5234CVM100J | 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
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