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参数资料
| 型号： | MCF5275CVM133 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 133 MHz, RISC PROCESSOR, PBGA256 |
| 封装： | MAPBGA-256 |
| 文件页数： | 3/44页 |
| 文件大小： | 1242K |
| 代理商： | MCF5275CVM133 |
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Design Recommendations
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 2
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
11
2. VDD/PLLVDD and OVDD/SDVDD should track up to 0.9 V, then separate for the completion of
ramps with OVDD/SD VDD going to the higher external voltages. One way to accomplish this is to
use a low drop-out voltage regulator.
5.2.1.2
Power Down Sequence
If VDD/PLLVDD are powered down first, then sense circuits in the I/O pads will cause all output drivers to
be in a high impedance state. There is no limit on how long after VDD and PLLVDD power down before
OVDD or SDVDD must power down. VDD should not lag OVDD, SDVDD, or PLLVDD going low by more
than 0.4 V during power down or there will be undesired high current in the ESD protection diodes. There
are no requirements for the fall times of the power supplies.
The recommended power down sequence is as follows:
1. Drop VDD/PLLVDD to 0 V.
2. Drop OVDD/SDVDD supplies.
5.3
Decoupling
Place the decoupling capacitors as close to the pins as possible, but they can be outside the footprint
of the package.
0.1
F and 0.01 F at each supply input
5.4
Buffering
Use bus buffers on all data/address lines for all off-board accesses and for all on-board accesses
when excessive loading is expected. See electricals.
5.5
Pull-up Recommendations
Use external pull-up resistors on unused inputs. See pin table.
5.6
Clocking Recommendations
Use a multi-layer board with a separate ground plane.
Place the crystal and all other associated components as close to the EXTAL and XTAL (oscillator
pins) as possible.
Do not run a high frequency trace around crystal circuit.
Ensure that the ground for the bypass capacitors is connected to a solid ground trace.
Tie the ground trace to the ground pin nearest EXTAL and XTAL. This prevents large loop currents
in the vicinity of the crystal.
Tie the ground pin to the most solid ground in the system.
Do not connect the trace that connects the oscillator and the ground plane to any other circuit
element. This tends to make the oscillator unstable.
Tie XTAL to ground when an external oscillator is clocking the device.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCF5275CVM166 | 功能描述:微处理器 - MPU MCF5275 V2CORE 64KSRAM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MCF5275CVM166 | 制造商:Freescale Semiconductor 功能描述:Microprocessor IC |
| MCF5275CVM166J | 功能描述:32位微控制器 - MCU V2CORE 64KSRAM RoHS:否 制造商:Texas Instruments 核心:C28x 处理器系列:TMS320F28x 数据总线宽度:32 bit 最大时钟频率:90 MHz 程序存储器大小:64 KB 数据 RAM 大小:26 KB 片上 ADC:Yes 工作电源电压:2.97 V to 3.63 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:LQFP-80 安装风格:SMD/SMT |
| MCF5275LCVM133 | 功能描述:IC MCU 32BIT 133MHZ 196-MAPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:MCF527x 标准包装:250 系列:56F8xxx 核心处理器:56800E 芯体尺寸:16-位 速度:60MHz 连通性:CAN，SCI，SPI 外围设备:POR，PWM，温度传感器，WDT 输入/输出数:21 程序存储器容量:40KB（20K x 16） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:6K x 16 电压 - 电源 (Vcc/Vdd):2.25 V ~ 3.6 V 数据转换器:A/D 6x12b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:48-LQFP 包装:托盘 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| MCF5275LCVM166 | 功能描述:微处理器 - MPU MCF5275L V2CORE 64KSRAM RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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