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| 型号： | MCP14E3-E/MF |
| 厂商： | Microchip Technology |
| 文件页数： | 16/26页 |
| 文件大小： | 0K |
| 描述： | IC MOSFET DVR 4.0A DUAL 8DFN |
| 标准包装： | 60 |
| 配置： | 低端 |
| 输入类型： | 反相 |
| 延迟时间： | 46ns |
| 电流 - 峰： | 4A |
| 配置数： | 2 |
| 输出数： | 2 |
| 电源电压： | 4.5 V ~ 18 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-VDFN 裸露焊盘 |
| 供应商设备封装： | 8-DFN-S（6x5） |
| 包装： | 管件 |
| 产品目录页面： | 670 (CN2011-ZH PDF) |
MCP14E3/MCP14E4/MCP14E5
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
D1
D
b
e
N
L
K
E1
E
EXPOSED
PAD
E2
NOTE 1
1
2
D2
2
1
NOTE 1
A
φ
TOP VIEW
A2
BOTTOM VIEW
A1
A 3
Units
NOTE 2
MILLIMETERS
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
1.27 BSC
MAX
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
Model Draft Angle Top
A
A2
A1
A3
D
D1
D2
E
E1
E2
b
L
K
φ
–
–
0.00
3.85
2.16
0.35
0.50
0.20
–
0.85
0.65
0.01
0.20 REF
4.92 BSC
4.67 BSC
4.00
5.99 BSC
5.74 BSC
2.31
0.40
0.60
–
–
1.00
0.80
0.05
4.15
2.46
0.47
0.75
–
12°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-113B
DS22062B-page 16
? 2008 Microchip Technology Inc.
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