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| 型号： | MCP1700-2702E/TO |
| 厂商： | Microchip Technology |
| 文件页数： | 13/24页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 2.7V .25A TO-92-3 |
| 标准包装： | 1,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 2.7V |
| 输入电压： | 最高 6V |
| 电压 - 压降（标准）： | 0.178V @ 250mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 250mA（最小） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | TO-226-3、TO-92-3 标准主体 |
| 供应商设备封装： | TO-92-3 |
| 包装： | 散装 |
MCP1700
6.0
APPLICATION CIRCUITS &
EQUATION 6-2:
ISSUES
6.1 Typical Application
The MCP1700 is most commonly used as a voltage
regulator. It’s low quiescent current and low dropout
voltage make it ideal for many battery-powered
applications.
T J ( MAX ) = P TOTAL × R θ JA + T AMAX
T J(MAX) = Maximum continuous junction
temperature.
P TOTAL = Total device power dissipation.
R θ JA = Thermal resistance from junction to ambient.
T AMAX = Maximum ambient temperature.
V OUT
1.8V
I OUT
150 mA
MCP1700
GND
V IN
V OUT
C OUT
1 μF Ceramic
V IN
(2.3V to 3.2V)
C IN
1 μF Ceramic
The maximum power dissipation capability for a
package can be calculated given the junction-to-
ambient thermal resistance and the maximum ambient
temperature for the application. The following equation
can be used to determine the package maximum
internal power dissipation.
( T J ( MAX ) – T A ( MAX ) )
R θ JA
FIGURE 6-1: Typical Application Circuit.
6.1.1 APPLICATION INPUT CONDITIONS
Package Type = SOT-23
Input Voltage Range = 2.3V to 3.2V
V IN maximum = 3.2V
V OUT typical = 1.8V
I OUT = 150 mA maximum
EQUATION 6-3:
P D ( MAX ) = ---------------------------------------------------
P D(MAX) = Maximum device power dissipation.
T J(MAX) = Maximum continuous junction
temperature.
T A(MAX) = Maximum ambient temperature.
R θ JA = Thermal resistance from junction to ambient.
6.2
6.2.1
Power Calculations
POWER DISSIPATION
EQUATION 6-4:
T J ( RISE ) = P D ( MAX ) × R θ JA
The internal power dissipation of the MCP1700 is a
function of input voltage, output voltage and output
current. The power dissipation, as a result of the
quiescent current draw, is so low, it is insignificant
(1.6 μA x V IN ). The following equation can be used to
calculate the internal power dissipation of the LDO.
EQUATION 6-1:
P LDO = ( V IN ( MAX ) ) – V OUT ( MIN ) ) × I OUT ( MAX ) )
P LDO = LDO Pass device internal power dissipation
V IN(MAX) = Maximum input voltage
V OUT(MIN) = LDO minimum output voltage
The maximum continuous operating junction
temperature specified for the MCP1700 is +125 ° C . To
estimate the internal junction temperature of the
MCP1700, the total internal power dissipation is
multiplied by the thermal resistance from junction to
ambient (R θ JA ). The thermal resistance from junction to
ambient for the SOT-23 pin package is estimated at
230 ° C/W.
? 2007 Microchip Technology Inc.
T J(RISE) = Rise in device junction temperature over
the ambient temperature.
P TOTAL = Maximum device power dissipation.
R θ JA = Thermal resistance from junction to ambient.
EQUATION 6-5:
T J = T J ( RISE ) + T A
T J = Junction Temperature.
T J(RISE) = Rise in device junction temperature over
the ambient temperature.
T A = Ambient temperature.
DS21826B-page 13
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