参数资料
型号: MCP1725T-1802E/MC
厂商: Microchip Technology
文件页数: 19/32页
文件大小: 0K
描述: IC REG LDO 1.8V .5A 8DFN
产品培训模块: High Current LDOs
标准包装: 3,300
稳压器拓扑结构: 正,固定式
输出电压: 1.8V
输入电压: 2.3 V ~ 6 V
电压 - 压降(标准): 0.21V @ 500mA
稳压器数量: 1
电流 - 输出: 500mA(最小)
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-VFDFN 裸露焊盘
供应商设备封装: 8-DFN(2x3)
包装: 带卷 (TR)
MCP1725
4.8
Dropout Voltage and
4.9
Overtemperature Protection
Undervoltage Lockout
Dropout voltage is defined as the input-to-output
voltage differential at which the output voltage drops
2% below the nominal value that was measured with a
V R + 0.6V differential applied. The MCP1725 LDO has
a very low dropout voltage specification of 210 mV
(typical) at 0.5A of output current. See Section 1.0
“Electrical Characteristics” for maximum dropout
voltage specifications.
The MCP1725 LDO operates across an input voltage
range of 2.3V to 6.0V and incorporates input Undervolt-
age Lockout (UVLO) circuitry that keeps the LDO
output voltage off until the input voltage reaches a
minimum of 2.18V (typical) on the rising edge of the
input voltage. As the input voltage falls, the LDO output
will remain on until the input voltage level reaches
2.04V (typical).
Since the MCP1725 LDO undervoltage lockout
activates at 2.04V as the input voltage is falling, the
dropout voltage specification does not apply for output
voltages that are less than 1.9V.
For high-current applications, voltage drops across the
PCB traces must be taken into account. The trace
resistances can cause significant voltage drops
between the input voltage source and the LDO. For
applications with input voltages near 2.3V, these PCB
trace voltage drops can sometimes lower the input
voltage enough to trigger a shutdown due to
undervoltage lockout.
? 2007 Microchip Technology Inc.
The MCP1725 LDO has temperature-sensing circuitry
to prevent the junction temperature from exceeding
approximately 150 ° C. If the LDO junction temperature
does reach 150 ° C, the LDO output will be turned off
until the junction temperature cools to approximately
140 ° C, at which point the LDO output will automatically
resume normal operation. If the internal power
dissipation continues to be excessive, the device will
again shut off. The junction temperature of the die is a
function of power dissipation, ambient temperature and
package thermal resistance. See Section 5.0 “Appli-
cation Circuits/Issues” for more information on LDO
power dissipation and junction temperature.
DS22026B-page 19
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