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| 型号： | MCP2140A-I/SS |
| 厂商： | Microchip Technology |
| 文件页数： | 54/66页 |
| 文件大小： | 0K |
| 描述： | IC IRDA CONTROLLR DTE/DCE 20SSOP |
| 标准包装： | 67 |
| 控制器类型： | IRDA 标准协议栈控制器 |
| 接口： | UART |
| 电源电压： | 3 V ~ 5.5 V |
| 电流 - 电源： | 2.2mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SSOP（0.209"，5.30mm 宽） |
| 供应商设备封装： | 20-SSOP |
| 包装： | 管件 |
| 产品目录页面： | 685 (CN2011-ZH PDF) |
| 配用： | MCP2140DM-TMPSNS-ND - BOARD DEMO FOR MCP2140 |
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MCP2140A
DS22050B-page 58
2007-2011 Microchip Technology Inc.
C.1.3
IrLMP
The IrLMP protocol provides:
Multiplexing of the IrLAP layer. This allows
multiple channels above an IrLAP connection
Protocol and service discovery. This is
accomplished via the Information Access Service
(IAS)
When two devices that contain the IrDA standard fea-
ture are connected, there is generally one device that
has something to do and the other device that has the
resource to do it. For example, a laptop may have a job
to print and an IrDA standard compatible printer has the
resources to print it. In IrDA standard terminology, the
laptop is a primary device and the printer is the second-
ary device. When these two devices connect, the pri-
mary device must determine the capabilities of the
secondary device to determine if the secondary device
is capable of doing the job. This determination is made
by the primary device asking the secondary device a
series of questions. Depending on the answers to
these questions, the primary device may or may not
elect to connect to the secondary device.
The queries from the primary device are carried to the
secondary device using IrLMP. The responses to these
queries can be found in the IAS of the secondary
device. The IAS is a list of the resources of the second-
ary device. The primary device compares the IAS
responses with its requirements and then makes the
decision if a connection should be made.
C.1.4
LINK MANAGEMENT -
INFORMATION ACCESS SERVICE
(LM-IAS)
Each LM-IAS entity maintains an information database
to provide:
Information on services for other devices that
contain the IrDA standard feature (Discovery)
Information on services for the device itself
Remote accessing of another device’s information
base
This is required so that clients on a remote device can
find configuration information needed to access a
service.
C.1.5
TINY TP
Tiny TP provides the flow control on IrLMP
connections. An optional service of Segmentation and
Reassembly can be handled.
C.1.6
IrCOMM
IrCOMM provides the method to support serial and
parallel port emulation. This is useful for legacy COM
applications, such as printers and modem devices.
The IrCOMM standard is a syntax that allows the pri-
mary device to consider the secondary device a serial
device. IrCOMM allows for emulation of serial or
parallel (printer) connections of various capabilities.
FIGURE C-5:
IRCOMM SERVICE CLASSES
Note:
The MCP2140A supports the 9-wire
“cooked” service class of IrCOMM. Other
service classes supported by IrCOMM are
shown in Figure C-5.
IrCOMM Services
Uncooked Services
Cooked Services
Parallel
Serial
IrLPT
3-wire Raw
Parallel
Centronics
IEEE 1284
Serial
3-wire Cooked
9-wire Cooked
Supported by MCP2140A
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCP2140AT-I/P | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:IrDA㈢ Standard Protocol Stack Controller With Fixed 9600 Baud Communication Rate |
| MCP2140AT-I/SO | 功能描述:网络控制器与处理器 IC Enhanced MCP2140 Win Mobile 5.0 compatble RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray |
| MCP2140AT-I/SS | 功能描述:网络控制器与处理器 IC Enhanced MCP2140 Win Mobile 5.0 compatble RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray |
| MCP2140DM-TMPSNS | 功能描述:温度传感器开发工具 MCP2140 IrDA Wire- less Temp Demo RoHS:否 制造商:Texas Instruments 产品类型:Temperature Sensors and Control ICs 工具用于评估:MSP430G2553 接口类型:USB 工作电源电压: 工作电源电流: |
| MCP2140-I/P | 功能描述:网络控制器与处理器 IC 9600bd fixd spd IrDA RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray |
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