- 您现在的位置：买卖IC网 > PDF目录16673 > MCP2150DM (Microchip Technology)BOARD DEMO FOR MCP2150 PDF资料下载
参数资料
| 型号： | MCP2150DM |
| 厂商： | Microchip Technology |
| 文件页数： | 2/52页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO FOR MCP2150 |
| 标准包装： | 1 |
| 主要目的： | 接口，IrDA |
| 嵌入式： | 是，MCU，8 位 |
| 已用 IC / 零件： | MCP2150 |
| 主要属性： | 带 PIC18F MCU 的 IrDA 控制器 |
| 次要属性： | USB 接口 |
| 已供物品： | 板 |
| 产品目录页面： | 685 (CN2011-ZH PDF) |
第1页当前第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页
MCP2150
DS21655B-page 10
Preliminary
2002 Microchip Technology Inc.
2.8
Minimizing Power
The device can be placed in a low power mode by dis-
abling the device (holding the EN pin at the low state).
The internal state machine is monitoring this pin for a
low level and, once this is detected, the device is
disabled and enters into a low power state.
2.8.1
RETURNING TO DEVICE
OPERATION
When disabled, the device is in a low power state.
When the EN pin is brought to a high level, the device
will return to the operating mode. The device requires
a delay of 1024 TOSC before data may be transmitted
or received.
2.9
Network Layering Reference
Model
Figure 2-5 shows the ISO Network Layering Reference
Model. The shaded areas are implemented by the
MCP2150, the cross-hatched area is implemented by
an infrared transceiver. The unshaded areas should be
implemented by the Host Controller.
FIGURE 2-5:
ISO REFERENCE LAYER MODEL
OSI REFERENCE LAYERS
Application
Presentation
Session
Transport
Network
Data Link Layer
LLC (Logical Link Control)
Acceptance Filtering
Overload Notification
Recovery Management
MAC (Medium Access Control)
Data Encapsulation/Decapsulation
Frame Coding (stuffing, destuffing)
Medium Access Management
Error Detection
Error Signalling
Acknowledgment
Serialization/Deserialization
Physical Layer
PLS (Physical Signalling)
Bit Encoding/Decoding
Bit Timing
Synchronization
PMA (Physical Medium Attachment)
Driver/Receiver Characteristics
MDI (Medium Dependent Interface)
Connectors
Fault
confinement
(MAC-LME)
Bus Failure
management
(PLS-LME)
Supervisor
Regions implemented
by the MCP2150
Has to be implemented in Host
Controller firmware
Regions implemented
by the Optical Transceiver logic
(such as a PICmicro
microcontroller)
相关PDF资料 |
PDF描述 |
|---|---|
| GBM10DRSN-S664 | CONN EDGECARD 20POS DIP .156 SLD |
| CB5278-000 | HEAT SHRINK TUBING |
| ELC-10D390E | COIL CHOKE 39UH RADIAL |
| CB5270-000 | HEAT SHRINK TUBING |
| VI-BWV-EX | CONVERTER MOD DC/DC 5.8V 75W |
相关代理商/技术参数 |
参数描述 |
|---|---|
| MCP2150-I/P | 功能描述:输入/输出控制器接口集成电路 IrDA protocol handlr RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| MCP2150-I/P | 制造商:Microchip Technology Inc 功能描述:IC IRDA CONTROLLER 2150 DIP18 |
| MCP2150-I/SO | 功能描述:输入/输出控制器接口集成电路 IrDA protocol handlr RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| MCP2150-I/SO | 制造商:Microchip Technology Inc 功能描述:IRDA CONTROLLER SMD 2150 SOIC18 |
| MCP2150-I/SORVB | 制造商:Microchip 功能描述:MCP2150 Series 115.2 kBaud 64 Byte Standard Protocol Stack Controller - SOIC-18 |
发布紧急采购，3分钟左右您将得到回复。