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| 型号： | MCZ33291LEG |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 21/26页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH 8X LOSIDE W/SPI 24SOIC |
| 标准包装： | 30 |
| 类型： | 低端 |
| 输入类型： | SPI |
| 输出数： | 8 |
| 导通状态电阻： | 1.1 欧姆 |
| 电流 - 输出 / 通道： | 500mA |
| 电流 - 峰值输出： | 3A |
| 电源电压： | 9 V ~ 26.5 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 24-SOIC W |
| 包装： | 管件 |
FUNCTIONAL DESCRIPTION
conducted with the device mounted on a typical PC board
placed horizontally in a 33 cubic inch still air enclosure. The
PC board was made of FR4 material measuring 2.5 by 2.5
inches, having double-sided circuit traces of 1.0 ounce
copper soldered to each device pin. The board temperature
was measured with thermal couple soldered to the board
surface one inch away from the center of the device. The
ambient temperature of the enclosure was measured with a
second thermal couple located over the center of one inch
distance from device.
THERMAL PERFORMANCE
Figure 21 illustrates the worst case thermal component
parameters values for the 33291L in the 24 lead SOIC wide
body surface mount package. Pins 5, 6, 7, 8, 17, 18, 19, and
20 of the package were connected directly to the lead frame
flag. The parameter values indicated take into account
adjacent output combinations. The characterization was
conducted over power dissipation levels of 0.7 W to 17 W.
The junction-to-ambient temperature resistance was found to
be 40°C/W with a single output active (34°C/W with all
outputs dissipating equal power 0 and the thermal resistance
from junction-to-PC board (R JUNCTION-BOARD ) to be 30°C/W
(board temperature, measure one inch from device center).
The junction-to-heatsink lead resistance was found again to
approximate 10°C/W. Devoting additional PC board metal
around the heatsinking pins for this package improved the
R pkg from 33° to 31°C/W.
The total power dissipation available is dependent on the
number of outputs enabled at any one time. At 25°C the
R DS(ON) in 450 m Ω with a coefficient of 6500 ppm/°C. For the
junction temperature to remain below 150°C, the maximum
available power dissipation must decrease as the ambient
temperature increases. Figure 24 depicts the per output limit
of current at ambient temperatures necessary when one,
four, or eight outputs are enable ON. Figure 23 illustrates
how the R DS(ON) output value is affected by junction
temperature.
Junction Temperature Node
VD - TD (C°)
(Volts represent Die Surface Temperature)
Output 0
Output 1
Output 2
Output 6
Output 7
Rd0
Cd0
Rd1
Cd1
Rd2
Cd2
Rd6
Cd6
Rd7
Cd7
IPWR (Steady State or Transient)
(1.0 A = 1.0 W of Device Power Dissipation)
Rpkg = Rleads + RPC Board
Flag Temperature Node
Cpkg = Cflag + CPC Board
Ambient Temperature Node
Package
24-Lead
SOIC
Rdx
( Ω )*
7.0
C dx
(F)*
0.002
R pkg
( Ω )*
33
C pkg
(F)*
0.15
VA = TA (C°)
(1.0 V = 1°C Ambient Temperature)
* Ω = °C/W, F = W s/°C, IPWR = W, and VA = °C
Figure 21. Thermal Model (Electrical Equivalent)
33291L
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MCZ33291LEGR2 | 功能描述:电源开关 IC - 配电 BASIC OCTAL SER SW RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| MCZ33298EG | 功能描述:电源开关 IC - 配电 OCTAL SERIAL SWITCH RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| MCZ33298EG/R2 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Eight Output Switch with Serial Peripheral Interface I/O |
| MCZ33298EGR2 | 功能描述:电源开关 IC - 配电 OCTAL SERIAL SWITCH RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| MCZ3334EF | 功能描述:基准电压& 基准电流 HI ENERGY IGNITION RoHS:否 制造商:STMicroelectronics 产品:Voltage References 拓扑结构:Shunt References 参考类型:Programmable 输出电压:1.24 V to 18 V 初始准确度:0.25 % 平均温度系数（典型值）:100 PPM / C 串联 VREF - 输入电压（最大值）: 串联 VREF - 输入电压（最小值）: 分流电流（最大值）:60 mA 最大工作温度:+ 125 C 封装 / 箱体:SOT-23-3L 封装:Reel |
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