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参数资料
| 型号： | MGW30N60 |
| 厂商： | MOTOROLA INC |
| 元件分类： | IGBT 晶体管 |
| 英文描述： | Insulated Gate Bipolar Transistor |
| 中文描述： | 50 A, 600 V, N-CHANNEL IGBT, TO-247AE |
| 文件页数： | 2/6页 |
| 文件大小： | 214K |
| 代理商： | MGW30N60 |
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS
(TJ = 25
°
C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Collector–to–Emitter Breakdown Voltage
(VGE = 0 Vdc, IC = 250
μ
Adc)
Temperature Coefficient (Positive)
BVCES
600
—
—
870
—
—
Vdc
mV/
°
C
Emitter–to–Collector Breakdown Voltage (VGE = 0 Vdc, IEC = 100 mAdc)
Zero Gate Voltage Collector Current
(VCE = 600 Vdc, VGE = 0 Vdc)
(VCE = 600 Vdc, VGE = 0 Vdc, TJ = 125
°
C)
Gate–Body Leakage Current (VGE =
±
20 Vdc, VCE = 0 Vdc)
BVECS
ICES
25
—
—
Vdc
—
—
—
—
100
2500
μ
Adc
IGES
—
—
250
nAdc
ON CHARACTERISTICS (1)
Collector–to–Emitter On–State Voltage
(VGE = 15 Vdc, IC = 15 Adc)
(VGE = 15 Vdc, IC = 15 Adc, TJ = 125
°
C)
(VGE = 15 Vdc, IC = 30 Adc)
VCE(on)
—
—
—
2.20
2.10
2.60
2.90
—
3.45
Vdc
Gate Threshold Voltage
(VCE = VGE, IC = 1 mAdc)
Threshold Temperature Coefficient (Negative)
VGE(th)
4.0
—
6.0
10
8.0
—
Vdc
mV/
°
C
Forward Transconductance (VCE = 10 Vdc, IC = 30 Adc)
gfe
—
15
—
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
f = 1.0 MHz)
Cies
Coes
Cres
—
4280
—
pF
Output Capacitance
(VCE = 25 Vdc, VGE = 0 Vdc,
—
275
—
Transfer Capacitance
—
19
—
SWITCHING CHARACTERISTICS (1)
Turn–On Delay Time
Energy losses include “tail”
td(on)
tr
td(off)
tf
Eoff
td(on)
tr
—
76
—
ns
Rise Time
(VCC = 360 Vdc, IC = 30 Adc,
RG = 20
,
TJ = 25
°
C)
—
80
—
Turn–Off Delay Time
VGE = 15 Vdc, L = 300 H
—
348
—
Fall Time
—
188
—
Turn–Off Switching Loss
—
0.98
1.28
mJ
Turn–On Delay Time
Energy losses include “tail”
—
73
—
ns
Rise Time
(VCC = 360 Vdc, IC = 30 Adc,
,
°
RG = 20
TJ = 125
C)
—
95
—
Turn–Off Delay Time
VGE = 15 Vdc, L = 300 H
td(off)
tf
Eoff
QT
Q1
Q2
—
394
—
Fall Time
H
—
418
—
Turn–Off Switching Loss
—
1.90
—
mJ
Gate Charge
VGE = 15 Vdc)
—
150
—
nC
(VCC = 360 Vdc, IC = 30 Adc,
—
30
—
—
45
—
INTERNAL PACKAGE INDUCTANCE
Internal Emitter Inductance
(Measured from the emitter lead 0.25
″
from package to emitter bond pad)
LE
—
13
—
nH
(1) Pulse Test: Pulse Width
≤
300
μ
s, Duty Cycle
≤
2%.
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